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Special tetrahedral twins in a cryogenically deformed CoCrFeNi high-entropy alloy
Li, Wei1,2; Liu, Hanyang3; Yin, Peihua2; Yan, Wei2; Wang, Wei2; Shan, Yiyin2; Yang, Ke2
Corresponding AuthorWang, Wei(wangw@imr.ac.cn)
2022-02-20
Source PublicationJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
Volume100Pages:129-136
Funding OrganizationYouth Innovation Promotion Association of Chinese Academy of Sciences ; National Natural Science Foundation of China Research Fund for International Young Scientists ; National Natural Science Foundation of China
DOI10.1016/j.jmst.2021.05.045
Indexed BySCI
Language英语
Funding ProjectYouth Innovation Promotion Association of Chinese Academy of Sciences[2017233] ; National Natural Science Foundation of China Research Fund for International Young Scientists[51750110515] ; National Natural Science Foundation of China[51472249]
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000743581400004
PublisherJOURNAL MATER SCI TECHNOL
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/173704
Collection中国科学院金属研究所
Corresponding AuthorWang, Wei
Affiliation1.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shi Changxu Innovat Ctr Adv Mat, Shenyang 110016, Peoples R China
3.Beijing Inst Technol, Sch Mat Sci & Engn, Beijing 100081, Peoples R China
Recommended Citation
GB/T 7714
Li, Wei,Liu, Hanyang,Yin, Peihua,et al. Special tetrahedral twins in a cryogenically deformed CoCrFeNi high-entropy alloy[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2022,100:129-136.
APA Li, Wei.,Liu, Hanyang.,Yin, Peihua.,Yan, Wei.,Wang, Wei.,...&Yang, Ke.(2022).Special tetrahedral twins in a cryogenically deformed CoCrFeNi high-entropy alloy.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,100,129-136.
MLA Li, Wei,et al."Special tetrahedral twins in a cryogenically deformed CoCrFeNi high-entropy alloy".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 100(2022):129-136.
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