Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System

doi:10.11900/0412.1961.2021.00216

IMR OpenIR

	Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System
	Zhou Lijun 1,2; Wei Song 1,2,3; Guo Jingdong 1,2; Sun Fangyuan 4; Wang Xinwei 5; Tang Dawei 5
通讯作者	Guo Jingdong(jdguo@imr.ac.cn) ; Sun Fangyuan(sunfangyuan@ustb.edu.cn)
	2022-12-11
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	58 期号:12 页码:1645-1654
摘要	An accurate temperature analysis of electronic packaging requires an understanding of the thermal-transport parameters of the material. However, studies on the thermal conductivity of intermetallic compounds (IMCs) in micro-interconnect solder joints are scarce, particularly common IMCs forming in Cu-Sn systems, which seriously affect the precise prediction of the temperature field and thermal stress for electronic packaging structures. This work proposes a novel method to quantitatively measure the thermophysical parameters of Cu-Sn IMCs based on the dual-wavelength femtosecond laser timedomain thermoreflectance (TDTR) system. Cu-Sn diffusion couple samples were prepared using a reflow and aging process. Two layers of Cu6Sn5 and Cu3Sn IMCs formed at the interface with micron thickness, and the (001) crystal plane of Cu6Sn5 was the preferred orientation. The sensitivity of the experimental parameters to the measurement parameters affects the fitting accuracy. Therefore, before testing, the effects of the aluminum transducer thickness and pump laser modulation frequency on the phase signal sensitivity in the thermal conductivity measurements of Cu6Sn5 and Cu3Sn were analyzed to help select the specific experimental parameters. After testing, the thermal conductivities of Cu6Sn5 and Cu3Sn were 47.4 and 87.6 W/(m center dot K), respectively, which are slightly higher than the previous results because of the microstructure discrepancy caused by different material preparation techniques. Finally, the influence of the pump laser diameter, aluminum transducer thickness, and material specific heat on the measurement error of thermal conductivity for Cu6Sn5 and Cu3Sn was examined. The test errors of the Cu6Sn5 and Cu3Sn thermal conductivity were -6.8%similar to 4.6% and -7.1%similar to 4.4%, respectively. Overall, the TDTR technology can evaluate the thermal-transport characteristics of micron-scale intermetallic compounds in electronic packaging and guide the thermal design and reliability evaluations of electronic components.
关键词	femtosecond laser time-domain thermoreflectance intermetallic compounds thermal conductivity
资助者	National Natural Science Foundation of China ; National Key Scientific Instrument and Equipment Development Projects of China ; Fundamental Research Funds for the Central Universities
DOI	10.11900/0412.1961.2021.00216
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[51971231] ; National Natural Science Foundation of China[52105327] ; National Natural Science Foundation of China[51720105007] ; National Key Scientific Instrument and Equipment Development Projects of China[2013YQ120355] ; Fundamental Research Funds for the Central Universities
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000905303700011
出版者	SCIENCE PRESS
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/175480
专题	中国科学院金属研究所
通讯作者	Guo Jingdong; Sun Fangyuan
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Guilin Univ Elect Technol, Sch Mech & Elect Engn, Guilin 541004, Peoples R China 4.Univ Sci & Technol Beijing, Sch Energy & Environm Engn, Beijing 100083, Peoples R China 5.Dalian Univ Technol, Sch Energy & Power Engn, Dalian 116024, Peoples R China
推荐引用方式 GB/T 7714	Zhou Lijun,Wei Song,Guo Jingdong,et al. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. ACTA METALLURGICA SINICA,2022,58(12):1645-1654.
APA	Zhou Lijun,Wei Song,Guo Jingdong,Sun Fangyuan,Wang Xinwei,&Tang Dawei.(2022).Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System.ACTA METALLURGICA SINICA,58(12),1645-1654.
MLA	Zhou Lijun,et al."Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System".ACTA METALLURGICA SINICA 58.12(2022):1645-1654.