Effects of stacking fault energy on deformation induced grain boundary relaxation in nanograined Cu alloys

doi:10.1016/j.actamat.2022.118256

IMR OpenIR

	Effects of stacking fault energy on deformation induced grain boundary relaxation in nanograined Cu alloys
	Sun, Y. A.1,2; Luo, Z. P.1; Li, X. Y.1; Lu, K.1
通讯作者	Li, X. Y.(xyli@imr.ac.cn)
	2022-10-15
发表期刊	ACTA MATERIALIA
ISSN	1359-6454
卷号	239 页码:9
摘要	Deformation induced grain boundary (GB) relaxation with resultant enhancements in thermal stability was observed in various metals with grain sizes below a critical size. In this study, effects of stacking fault energy (SFE) on the GB relaxation and thermal stability are investigated in several Cu-Ni and Cu-Al alloys with gradient nanograined samples prepared using the surface mechanical grinding treatment. For each alloy, thermal stability drops with a decreasing grain size from submicrometers to about 70 nm. However, two distinct grain size dependences of thermal stability were observed below 70 nm. For Cu-10Ni and Cu-5Ni alloys with higher SFEs than Cu, thermal stability increases for smaller grains, similar to that in pure Cu. For Cu-10Al and Cu-5Al with lower SFEs than Cu, as grain sizes decrease the thermal stability elevates firstly and then drops, exhibiting a stability peak at a certain size. The observed thermal stability in the Cu alloys below 70 nm can be attributed to the GB relaxation induced by plastic deformation dominated by partial dislocation activities. The different behaviors of GB relaxation in these Cu alloys demonstrated its obvious dependence on SFE, which determined the governing deformation mechanisms and hence the degree of relaxation of GBs.(c) 2022 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
关键词	Nanograined metals Grain boundary relaxation Thermal stability Stacking fault energy Cu alloys
资助者	CAS -HK Joint Laboratory of Nanomaterials and Mechanics ; Ministry of Science and Technology of the People?s Republic of China
DOI	10.1016/j.actamat.2022.118256
收录类别	SCI
语种	英语
资助项目	CAS -HK Joint Laboratory of Nanomaterials and Mechanics ; Ministry of Science and Technology of the People?s Republic of China[2017YFA0700700] ; Ministry of Science and Technology of the People?s Republic of China[2017YFA0204401]
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000861076600001
出版者	PERGAMON-ELSEVIER SCIENCE LTD
引用统计	被引频次：12[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/175807
专题	中国科学院金属研究所
通讯作者	Li, X. Y.
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Sun, Y. A.,Luo, Z. P.,Li, X. Y.,et al. Effects of stacking fault energy on deformation induced grain boundary relaxation in nanograined Cu alloys[J]. ACTA MATERIALIA,2022,239:9.
APA	Sun, Y. A.,Luo, Z. P.,Li, X. Y.,&Lu, K..(2022).Effects of stacking fault energy on deformation induced grain boundary relaxation in nanograined Cu alloys.ACTA MATERIALIA,239,9.
MLA	Sun, Y. A.,et al."Effects of stacking fault energy on deformation induced grain boundary relaxation in nanograined Cu alloys".ACTA MATERIALIA 239(2022):9.