IMR OpenIR
Thermodynamics and kinetics of interdiffusion in Ni//NiAl diffusion couples
Gao, Xinyu1,2; Martin, Seyring3; Wen, Xin1,2; Tian, Yuan4; Zhang, Bing1,2; Wang, Yongqiang1,2; Chen, Yipeng1,2; Qiao, Shichang1,2; Wang, Fengzhen1,2; Liu, Shuai2; Yuan, Chao1,2
Corresponding AuthorYuan, Chao(ychao@imr.ac.cn)
2024-01-15
Source PublicationJOURNAL OF ALLOYS AND COMPOUNDS
ISSN0925-8388
Volume971Pages:11
AbstractThe growth behavior of Ni3Al after nucleation at the Ni/NiAl interface was investigated by using macroscopic diffusion couples at low annealing temperatures of 973-1073 K. The thickness and grain size of the Ni3Al phase at different annealing temperatures were statistically analyzed by scanning electron microscopy to evaluate the growth kinetics of the Ni3Al layer. According to the growth rate exponent, the growth of Ni3Al layer to NiAl is almost completely controlled by volume diffusion (VD) when it is above 1023 K, and by boundary diffusion (BD) when it is below 1023 K. In contrast, the growth of Ni3Al into Ni is controlled by VD almost whether at 1023 K or 1073 K. Remarkably, a continuous Al-rich Ni grain layer was formed at the Ni3Al/Ni interface by diffusioninduced recrystallization (DIR), and the experimental results for DIR region of composition and growth behavior were numerically analyzed using the thermodynamic and kinetic models, respectively. The analyses suggest that the composition of the DIR region in the Ni(Al) binary system can be determined by the thermodynamic conditions of the chemical driving force model (CDF model). Additionally, kinetic analysis using the new extended model (NE model) indicates that under current annealing conditions, interface reaction and BD control growth at the moving boundary of the DIR region. Furthermore, the temperature stability range of Ni5Al3 in the Ni//NiAl system was subjected to systematic analysis.
KeywordIntermetallics Solid-state phase transformation Thermodynamics and kinetics Nickel aluminum diffusion induced recrystallization
DOI10.1016/j.jallcom.2023.172751
Indexed BySCI
Language英语
WOS Research AreaChemistry ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectChemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:001107069200001
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:3[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/177331
Collection中国科学院金属研究所
Corresponding AuthorYuan, Chao
Affiliation1.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
3.Friedrich Schiller Univ Jena, Otto Schott Inst Mat Res, Lobdergraben 32, D-07743 Jena, Germany
4.Dalian Jiaotong Univ, Sch Mat Sci & Engn, Dalian 116028, Peoples R China
Recommended Citation
GB/T 7714
Gao, Xinyu,Martin, Seyring,Wen, Xin,et al. Thermodynamics and kinetics of interdiffusion in Ni//NiAl diffusion couples[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2024,971:11.
APA Gao, Xinyu.,Martin, Seyring.,Wen, Xin.,Tian, Yuan.,Zhang, Bing.,...&Yuan, Chao.(2024).Thermodynamics and kinetics of interdiffusion in Ni//NiAl diffusion couples.JOURNAL OF ALLOYS AND COMPOUNDS,971,11.
MLA Gao, Xinyu,et al."Thermodynamics and kinetics of interdiffusion in Ni//NiAl diffusion couples".JOURNAL OF ALLOYS AND COMPOUNDS 971(2024):11.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Gao, Xinyu]'s Articles
[Martin, Seyring]'s Articles
[Wen, Xin]'s Articles
Baidu academic
Similar articles in Baidu academic
[Gao, Xinyu]'s Articles
[Martin, Seyring]'s Articles
[Wen, Xin]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Gao, Xinyu]'s Articles
[Martin, Seyring]'s Articles
[Wen, Xin]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.