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Transfer or blockage: Unraveling the interaction between deformation twinning and grain boundary in tantalum under shock loading with molecular dynamics
Meng, Z. C.1,2,3; Yang, M. M.1; Feng, A. H.4; Qu, S. J.4; Zhao, F.5; Yang, L.6,7; Yao, J. H.6,7; Yang, Y.1; Fan, Q. B.6,7; Wang, H.1
Corresponding AuthorQu, S. J.(qushoujiang@tongji.edu.cn) ; Zhao, F.(zhaof3@sustech.edu.cn) ; Wang, H.(haowang7@usst.edu.cn)
2023-09-01
Source PublicationJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
Volume156Pages:118-128
AbstractThe interaction between {112} < 111> deformation twinning and grain boundary in coaxial polycrystalline tantalum under shock compression was studied with molecular dynamics simulation under different grain pair misorientation angles (MA) and geometric compatibility factor ( m '). Generally, in the coax-ial polycrystal, the value of MA determines the occurrence of twin transfer (TT) or twin blockage (TB), i.e., twin transfer occurs at MA a 29 degrees with twin blockage otherwise. Under TT, the value of m ' affects the selection of twin variants., i.e., the twin system with a larger m ' is easier to active. The morphol-ogy of twin pairs is ruler-shaped and lenticular under TT and TB, respectively, with different thickening mechanisms, including grain boundary dislocation emission.(c) 2023 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
KeywordPlasticity Grain boundary Twin Atomistic simulation Tantalum
Funding OrganizationKey-Area Research and Development Program of GuangDong Province ; National Key Laboratory Foundation of Science and Technology on Materials under Shock and Impact ; Shanghai Engineering Research Center of High-Performance Medical Device Materials ; Major Science and Technology Infrastructure Project of Material Genome Big-science
DOI10.1016/j.jmst.2023.01.039
Indexed BySCI
Language英语
Funding ProjectKey-Area Research and Development Program of GuangDong Province[2019B010941001] ; National Key Laboratory Foundation of Science and Technology on Materials under Shock and Impact[6142902220301] ; Shanghai Engineering Research Center of High-Performance Medical Device Materials[20DZ2255500] ; Major Science and Technology Infrastructure Project of Material Genome Big-science
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectMaterials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000972371100001
PublisherJOURNAL MATER SCI TECHNOL
Citation statistics
Cited Times:10[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/177555
Collection中国科学院金属研究所
Corresponding AuthorQu, S. J.; Zhao, F.; Wang, H.
Affiliation1.Univ Shanghai Sci & Technol, Interdisciplinary Ctr Addit Mfg ICAM, Sch Mat & Chem, Shanghai 200093, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
3.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
4.Tongji Univ, Sch Mat Sci & Engn, Shanghai 201804, Peoples R China
5.Southern Univ Sci & Technol, Acad Adv Interdisciplinary Studies, Shenzhen 518055, Peoples R China
6.Beijing Inst Technol, Sch Mat Sci & Engn, Natl Key Lab Sci & Technol Mat Shock & Impact, Beijing 100081, Peoples R China
7.Beijing Inst Technol Chongqing Innovat Ctr, Chongqing 401135, Peoples R China
Recommended Citation
GB/T 7714
Meng, Z. C.,Yang, M. M.,Feng, A. H.,et al. Transfer or blockage: Unraveling the interaction between deformation twinning and grain boundary in tantalum under shock loading with molecular dynamics[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2023,156:118-128.
APA Meng, Z. C..,Yang, M. M..,Feng, A. H..,Qu, S. J..,Zhao, F..,...&Wang, H..(2023).Transfer or blockage: Unraveling the interaction between deformation twinning and grain boundary in tantalum under shock loading with molecular dynamics.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,156,118-128.
MLA Meng, Z. C.,et al."Transfer or blockage: Unraveling the interaction between deformation twinning and grain boundary in tantalum under shock loading with molecular dynamics".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 156(2023):118-128.
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