Transfer or blockage: Unraveling the interaction between deformation twinning and grain boundary in tantalum under shock loading with molecular dynamics | |
Meng, Z. C.1,2,3; Yang, M. M.1; Feng, A. H.4; Qu, S. J.4; Zhao, F.5; Yang, L.6,7; Yao, J. H.6,7; Yang, Y.1; Fan, Q. B.6,7; Wang, H.1 | |
Corresponding Author | Qu, S. J.(qushoujiang@tongji.edu.cn) ; Zhao, F.(zhaof3@sustech.edu.cn) ; Wang, H.(haowang7@usst.edu.cn) |
2023-09-01 | |
Source Publication | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
![]() |
ISSN | 1005-0302 |
Volume | 156Pages:118-128 |
Abstract | The interaction between {112} < 111> deformation twinning and grain boundary in coaxial polycrystalline tantalum under shock compression was studied with molecular dynamics simulation under different grain pair misorientation angles (MA) and geometric compatibility factor ( m '). Generally, in the coax-ial polycrystal, the value of MA determines the occurrence of twin transfer (TT) or twin blockage (TB), i.e., twin transfer occurs at MA a 29 degrees with twin blockage otherwise. Under TT, the value of m ' affects the selection of twin variants., i.e., the twin system with a larger m ' is easier to active. The morphol-ogy of twin pairs is ruler-shaped and lenticular under TT and TB, respectively, with different thickening mechanisms, including grain boundary dislocation emission.(c) 2023 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology. |
Keyword | Plasticity Grain boundary Twin Atomistic simulation Tantalum |
Funding Organization | Key-Area Research and Development Program of GuangDong Province ; National Key Laboratory Foundation of Science and Technology on Materials under Shock and Impact ; Shanghai Engineering Research Center of High-Performance Medical Device Materials ; Major Science and Technology Infrastructure Project of Material Genome Big-science |
DOI | 10.1016/j.jmst.2023.01.039 |
Indexed By | SCI |
Language | 英语 |
Funding Project | Key-Area Research and Development Program of GuangDong Province[2019B010941001] ; National Key Laboratory Foundation of Science and Technology on Materials under Shock and Impact[6142902220301] ; Shanghai Engineering Research Center of High-Performance Medical Device Materials[20DZ2255500] ; Major Science and Technology Infrastructure Project of Material Genome Big-science |
WOS Research Area | Materials Science ; Metallurgy & Metallurgical Engineering |
WOS Subject | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS ID | WOS:000972371100001 |
Publisher | JOURNAL MATER SCI TECHNOL |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/177555 |
Collection | 中国科学院金属研究所 |
Corresponding Author | Qu, S. J.; Zhao, F.; Wang, H. |
Affiliation | 1.Univ Shanghai Sci & Technol, Interdisciplinary Ctr Addit Mfg ICAM, Sch Mat & Chem, Shanghai 200093, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 3.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 4.Tongji Univ, Sch Mat Sci & Engn, Shanghai 201804, Peoples R China 5.Southern Univ Sci & Technol, Acad Adv Interdisciplinary Studies, Shenzhen 518055, Peoples R China 6.Beijing Inst Technol, Sch Mat Sci & Engn, Natl Key Lab Sci & Technol Mat Shock & Impact, Beijing 100081, Peoples R China 7.Beijing Inst Technol Chongqing Innovat Ctr, Chongqing 401135, Peoples R China |
Recommended Citation GB/T 7714 | Meng, Z. C.,Yang, M. M.,Feng, A. H.,et al. Transfer or blockage: Unraveling the interaction between deformation twinning and grain boundary in tantalum under shock loading with molecular dynamics[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2023,156:118-128. |
APA | Meng, Z. C..,Yang, M. M..,Feng, A. H..,Qu, S. J..,Zhao, F..,...&Wang, H..(2023).Transfer or blockage: Unraveling the interaction between deformation twinning and grain boundary in tantalum under shock loading with molecular dynamics.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,156,118-128. |
MLA | Meng, Z. C.,et al."Transfer or blockage: Unraveling the interaction between deformation twinning and grain boundary in tantalum under shock loading with molecular dynamics".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 156(2023):118-128. |
Files in This Item: | There are no files associated with this item. |
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment