Design of anti-mildew smart microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating

doi:10.1016/j.porgcoat.2023.107568

IMR OpenIR

	Design of anti-mildew smart microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating
	Li, Bowen 1,2; Ma, Yuantai 1; Njoku, Demian 1; Meng, Meijiang 1; Tang, Ao 1; Li, Ying 1,3
通讯作者	Tang, Ao(a.tang@imr.ac.cn) ; Li, Ying(liying@imr.ac.cn)
	2023-07-01
发表期刊	PROGRESS IN ORGANIC COATINGS
ISSN	0300-9440
卷号	180 页码:12
摘要	Moisture protection, anti-mildew and anti-corrosion are essential to guarantee the normal service of electronic devices. Although the epoxy holds great potential for electronic packaging, its inferior anti-corrosive performance and anti-mildew capability significantly affect the lifespan of the coating and thus impede further technological advances in electronic devices. To address this concern, herein, we fabricate environmental-friendly anti-mildew smart microcapsules (MCs) by encapsulating benzotriazole (BTA) loaded halloysite clay nanotubes (HNTs) with chitosan (CTS). The coating presents superior anti-mildew property with 5 wt% MCs addition. Furthermore, the charge transfer resistance (Rct) of T2 copper beneath the coating is three orders of magnitude larger after 35 days' immersion, which confirms a significantly promoted anti-corrosive performance for the coating. Moreover, mechanism study shows that such enhanced corrosion protective performance of proposed coating benefits from an excellent self-healing property enabled by a sustainable release of BTA with water and dual-pH sensitivity as well as effective adsorption of BTA on metal surface. It is further uncovered that the release rate of BTA is simultaneously determined by solubility of BTA, acid pH sensitivity of CTS and interaction between BTA and CTS. In addition, mechanical properties of coatings are enhanced with the tensile strength and elongation significantly increased, while the wet adhesion force (72 h) is also enlarged from 4.03 MPa to 7.22 MPa. Such a delicate design of environmental-friendly anti-mildew smart MCs not only enhances the corrosion protective property and the anti-mildew performance of the electronic packaging coatings, but also can facilitate the fabrication of other multifunctional organic coatings by utilizing multifunctional inhibitor or polyelectrolytes.
关键词	Smart microcapsule Halloysite clay nanotubes Chitosan Dual -pH sensitive Electronic packaging coating Anti -mildew
资助者	National Natural Science Foundation of China
DOI	10.1016/j.porgcoat.2023.107568
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[51871227] ; National Natural Science Foundation of China[52271079]
WOS研究方向	Chemistry ; Materials Science
WOS类目	Chemistry, Applied ; Materials Science, Coatings & Films
WOS记录号	WOS:000986779800001
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：7[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/177726
专题	中国科学院金属研究所
通讯作者	Tang, Ao; Li, Ying
作者单位	1.Chinese Acad Sci, Inst Met Res, Wencui Rd 62, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Wenhua Rd 72, Shenyang 110016, Peoples R China 3.Northeastern Univ, Shenyang Natl Lab Mat Sci, 3-11 Wenhua Rd, Shenyang 110819, Peoples R China
推荐引用方式 GB/T 7714	Li, Bowen,Ma, Yuantai,Njoku, Demian,et al. Design of anti-mildew smart microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating[J]. PROGRESS IN ORGANIC COATINGS,2023,180:12.
APA	Li, Bowen,Ma, Yuantai,Njoku, Demian,Meng, Meijiang,Tang, Ao,&Li, Ying.(2023).Design of anti-mildew smart microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating.PROGRESS IN ORGANIC COATINGS,180,12.
MLA	Li, Bowen,et al."Design of anti-mildew smart microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating".PROGRESS IN ORGANIC COATINGS 180(2023):12.