Crack suppression in electrodeposited brass film through controlling growth stresses by co-depositing with Bi

doi:10.1016/j.tsf.2023.139904

IMR OpenIR

	Crack suppression in electrodeposited brass film through controlling growth stresses by co-depositing with Bi
	Li, Ronghui 1,2; Guan, Yishan 3,4; Fan, Qinna 5
通讯作者	Li, Ronghui(lironghui@hgu.edu.cn)
	2023-07-31
发表期刊	THIN SOLID FILMS
ISSN	0040-6090
卷号	777 页码:9
摘要	The role of Bi in suppressing crack formation in the electrodeposited brass film is methodically examined by growing brass films from cyanide-free alkaline baths with and without Bi. Electrodeposition of the brass film with Bi produces crack-free films, whereas the brass film without Bi contains several cracks. In-situ film stress measurements by the cantilever curvature technique during the film deposition process reveal that compressive stresses are commonly generated in the film deposited with Bi, while tensile stresses are present in the brass film deposited without Bi. Both the compressive and tensile growth stresses grow with the increasing layer thickness for Bi-co-deposited and Bi-free films, respectively. Additionally, at large layer thicknesses, the growing stress in Bi-co-deposited film is highly compressive compared to the highly tensile stress developed in the Bi-free brass film. The obtained results indicate that such a change in film stress from tensile to compressive is essentially caused by grain size coarsening and stacking fault formation in the Bi-co-deposited films, because co-deposition with Bi alters the nucleation and growth of Cu-Zn grains in the electrodeposition process and the incorporation of Bi reduces the stacking fault energy of Cu-Zn alloy. This study provides a pathway to suppressing crack formation by controlling film stresses through Bi-co-deposition, thus growing crack-free brass films from environmentally friendly solutions.
关键词	Growth stress Brass Thin film Bismuth Stacking faults Cracking Crack free Electrodeposition
资助者	NV Bekaert SA Joint Research Initiative on Advanced Materials and Coatings
DOI	10.1016/j.tsf.2023.139904
收录类别	SCI
语种	英语
资助项目	NV Bekaert SA Joint Research Initiative on Advanced Materials and Coatings[BQ2019003]
WOS研究方向	Materials Science ; Physics
WOS类目	Materials Science, Multidisciplinary ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:001011455200001
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/178352
专题	中国科学院金属研究所
通讯作者	Li, Ronghui
作者单位	1.Hebei GEO Univ, Sch Gemol & Mat Sci, Shijiazhuang 050031, Peoples R China 2.Hebei GEO Univ, Lab rock & mineral new Mat, Shijiazhuang 050031, Peoples R China 3.Chinese Acad Sci, Inst Met Res, State Key Lab Corros & Protect, Shenyang 110016, Peoples R China 4.China Petr Pipeline Bur, Langfang 065000, Peoples R China 5.Shijiazhuang Tiedao Univ, Shijiazhuang 050043, Peoples R China
推荐引用方式 GB/T 7714	Li, Ronghui,Guan, Yishan,Fan, Qinna. Crack suppression in electrodeposited brass film through controlling growth stresses by co-depositing with Bi[J]. THIN SOLID FILMS,2023,777:9.
APA	Li, Ronghui,Guan, Yishan,&Fan, Qinna.(2023).Crack suppression in electrodeposited brass film through controlling growth stresses by co-depositing with Bi.THIN SOLID FILMS,777,9.
MLA	Li, Ronghui,et al."Crack suppression in electrodeposited brass film through controlling growth stresses by co-depositing with Bi".THIN SOLID FILMS 777(2023):9.