Thermal stability of nanograins with grain boundary relaxation in microalloyed Cu-Sb and Cu-Fe

doi:10.1016/j.jmst.2023.01.026

IMR OpenIR

	Thermal stability of nanograins with grain boundary relaxation in microalloyed Cu-Sb and Cu-Fe
	Zhu, R. J.1,2; Zhou, X.1; Li, X. Y.1
通讯作者	Zhou, X.(xzhou14s@imr.ac.cn)
	2023-08-20
发表期刊	JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN	1005-0302
卷号	155 页码:66-71
摘要	Grain refinement into nanoscale significantly enhances the strength and hardness of metallic materials but generally reduces the thermal stability by the introduced strong tendency for grain boundary (GB) migration. Stabilizing nanograins through GB relaxation had been proven as an effective way in several metals recently when the grain size is below a critical value. Here, we discovered that the abnormally enhanced thermal stability induced by GB relaxation can be realized in 0.5% Sb or Fe doped Cu, similar to that in pure Cu. The observed critical grain sizes for GB relaxation in the two Cu alloys are almost the same as pure Cu. However, the GB relaxation effect on thermal stability is kind of suppressed compared to pure Cu with similar grain sizes because of the segregation/precipitation of Sb/Fe during the annealing process, which accelerates the detwinning and the failure of relaxed GBs.& COPY; 2023 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
关键词	Thermal stability Grain boundary relaxation Nanograined Cu alloy Segregation Precipitate
资助者	Ministry of Science amp; Technology of China ; National Natural Science Foundation of China
DOI	10.1016/j.jmst.2023.01.026
收录类别	SCI
语种	英语
资助项目	Ministry of Science amp; Technology of China[2017YFA0700700] ; Ministry of Science amp; Technology of China[52001315] ; National Natural Science Foundation of China ; [2017YFA0204401]
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:001054185200001
出版者	JOURNAL MATER SCI TECHNOL
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/179039
专题	中国科学院金属研究所
通讯作者	Zhou, X.
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Zhu, R. J.,Zhou, X.,Li, X. Y.. Thermal stability of nanograins with grain boundary relaxation in microalloyed Cu-Sb and Cu-Fe[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2023,155:66-71.
APA	Zhu, R. J.,Zhou, X.,&Li, X. Y..(2023).Thermal stability of nanograins with grain boundary relaxation in microalloyed Cu-Sb and Cu-Fe.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,155,66-71.
MLA	Zhu, R. J.,et al."Thermal stability of nanograins with grain boundary relaxation in microalloyed Cu-Sb and Cu-Fe".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 155(2023):66-71.