Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair

doi:10.1016/j.engfailanal.2023.107549

IMR OpenIR

	Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair
	Lin, Y.1,2; Li, J. Z.3; Pan, J.1,2,3; Zhang, C.1,2; Ni, D. R.4; Chen, Q.5; Song, W. L.1,2; Lu, J. Y.6; Li, B.6; Liu, L.1,2
通讯作者	Pan, J.(jpan@hust.edu.cn) ; Liu, L.(lliu2000@mail.hust.edu.cn)
	2023-11-01
发表期刊	ENGINEERING FAILURE ANALYSIS
ISSN	1350-6307
卷号	153 页码:14
摘要	Cu/Al tribological pairs play a crucial role in maintaining the efficient operation of a wide range of engineering components. However, their durability is often compromised by wear-induced damage, which involves the accumulation of material at the Cu/Al friction interface. This study investigates the intricate wear behavior of Cu/Al tribological pairs under electrical current, with a specific emphasis on material transfer events occurring at the interface. Our findings reveal that the applied electric current exerts a lubricating effect on the sliding contact friction, resulting in reduced adhesive wear. However, it concurrently exacerbates fatigue-induced delamination, abrasive wear, and electrical wear. Through detailed analysis of interface temperatures and microstructure characterizations, we demonstrate that Al deposit adhesion occurs through interfacial metal mixing and nanoscale diffusion in the presence of only mechanical friction. Conversely, at high electrical currents, interfacial melting transpires, resulting in robust adhesion facilitated by the formation of an intermetallic compound. Our findings offer valuable insights into the microscopic adhesion events occurring in Cu/Al tribological pairs and provide guidance for developing innovative coating systems aimed at reducing material deposition in Cu/Al current-carrying friction interfaces.
关键词	Current-carrying wear Cu/Al tribological pairs Al deposit adhesion Interfacial microstructure
资助者	National Natural Science Foundation of China ; China Postdoctoral Science Foundation ; Youth Innovation Promotion Association of the Chinese Academy of Sciences
DOI	10.1016/j.engfailanal.2023.107549
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[92066202] ; National Natural Science Foundation of China[52001075] ; National Natural Science Foundation of China[92266103] ; National Natural Science Foundation of China[92166103] ; National Natural Science Foundation of China[52022100] ; China Postdoctoral Science Foundation[2021 M701290] ; Youth Innovation Promotion Association of the Chinese Academy of Sciences[2020194]
WOS研究方向	Engineering ; Materials Science
WOS类目	Engineering, Mechanical ; Materials Science, Characterization & Testing
WOS记录号	WOS:001069957200001
出版者	PERGAMON-ELSEVIER SCIENCE LTD
引用统计	被引频次：16[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/179269
专题	中国科学院金属研究所
通讯作者	Pan, J.; Liu, L.
作者单位	1.Huazhong Univ Sci & Technol, State Key Lab Mat Proc & Die & Mould Technol, Wuhan 430074, Peoples R China 2.Huazhong Univ Sci & Technol, Sch Mat Sci & Engn, Wuhan 430074, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 4.Chinese Acad Sci, Shi Changxu Innovat Ctr Adv Mat, Inst Met Res, Shenyang 110016, Peoples R China 5.Huazhong Univ Sci & Technol, Wuhan Natl High Magnet Field Ctr, Wuhan 430074, Peoples R China 6.Naval Univ Engn, Natl Key Lab Sci & Technol Vessel Integrated Power, Wuhan 430033, Peoples R China
推荐引用方式 GB/T 7714	Lin, Y.,Li, J. Z.,Pan, J.,et al. Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair[J]. ENGINEERING FAILURE ANALYSIS,2023,153:14.
APA	Lin, Y..,Li, J. Z..,Pan, J..,Zhang, C..,Ni, D. R..,...&Liu, L..(2023).Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair.ENGINEERING FAILURE ANALYSIS,153,14.
MLA	Lin, Y.,et al."Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair".ENGINEERING FAILURE ANALYSIS 153(2023):14.