Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process

doi:10.1007/s11771-025-5896-4

IMR OpenIR

	Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process
	Liu, Jin-song 1; Zhou, Yan 1; Wang, Song-wei 2; Chen, Shuai-feng 2; Song, Hong-wu 2; Zhang, Shi-hong 2
通讯作者	Wang, Song-wei(swwang16b@imr.ac.cn) ; Chen, Shuai-feng(chensf@imr.ac.cn)
	2025-03-07
发表期刊	JOURNAL OF CENTRAL SOUTH UNIVERSITY
ISSN	2095-2899
页码	21
摘要	The ultrafine copper wire with a diameter of 18 mu m is prepared via cold drawing process from the single crystal downcast billet (Phi 8 mm), taking a drawing strain to 12.19. In this paper, in-depth investigation of the microstructure feature, texture evolution, mechanical properties, and electrical conductivity of ultrafine wires ranging from Phi 361 mu m to Phi 18 mu m is performed. Specially, the microstructure feature and texture type covering the whole longitudinal section of ultrafine wires are elaborately characterized. The results show that the average lamella thickness decreases from 1.63 mu m to 102 nm during the drawing process. Whereas, inhomogeneous texture evolution across different wire sections was observed. The main texture type of copper wires are components of <111>, <001> and <112> orientations. Specifically, the peripheral region is primarily dominated by <111> and <112>, while the central region is <001> and <111>. As the drawing strain increases, the volume fraction of hard orientation <111> with low Schmid factor increase, where notably higher fraction of <111> is result from the consumption of <112> and <001> for the wire of Phi 18 mu m. For drawn copper wire of 18 mu m, superior properties are obtained with a tensile strength of 729.8 MPa and an electrical conductivity of 86.9% IACS. Furthermore, it is found that grain strengthening, dislocation strengthening, and texture strengthening are three primary strengthening mechanisms of drawn copper wire, while the dislocation density is main factor on the reducing of conductivity.
关键词	Copper wires ultrafine wire drawing texture evolution tensile strength
资助者	Unveiled the list of commanders Key Core Common Technology Projects of Jian ; Basic Scientific Research Project of the Education Department of Liaoning Province ; Natural Science Foundation Joint Fund for Innovation and Development Projects of Chongqing
DOI	10.1007/s11771-025-5896-4
收录类别	SCI
语种	英语
资助项目	Unveiled the list of commanders Key Core Common Technology Projects of Jian ; Basic Scientific Research Project of the Education Department of Liaoning Province[LJKMZ20220591] ; Natural Science Foundation Joint Fund for Innovation and Development Projects of Chongqing[CSTB2023NSCQ-LZX0116]
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:001438914900001
出版者	JOURNAL OF CENTRAL SOUTH UNIV
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/179852
专题	中国科学院金属研究所
通讯作者	Wang, Song-wei; Chen, Shuai-feng
作者单位	1.Shenyang Ligong Univ, Sch Mat Sci & Engn, Shenyang 110159, Peoples R China 2.Chinese Acad Sci, Shi Changxu Innovat Ctr Adv Mat, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Liu, Jin-song,Zhou, Yan,Wang, Song-wei,et al. Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process[J]. JOURNAL OF CENTRAL SOUTH UNIVERSITY,2025:21.
APA	Liu, Jin-song,Zhou, Yan,Wang, Song-wei,Chen, Shuai-feng,Song, Hong-wu,&Zhang, Shi-hong.(2025).Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process.JOURNAL OF CENTRAL SOUTH UNIVERSITY,21.
MLA	Liu, Jin-song,et al."Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process".JOURNAL OF CENTRAL SOUTH UNIVERSITY (2025):21.