Understanding the corrosion protection effect by surface oxide film to underlying Sn solder substrate under thermal exposure condition | |
Qiao, Chuang1; Wang, Youzhi1; Jiang, Jinli1; Wu, Qiong2; Hao, Long1; Fu, Haitao2; An, Xizhong2 | |
通讯作者 | Hao, Long(lhao@imr.ac.cn) |
2024-04-15 | |
发表期刊 | CORROSION SCIENCE
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ISSN | 0010-938X |
卷号 | 230页码:13 |
摘要 | Oxide film formed on Sn-based lead-free solder surface plays an important role in protecting the solder joints in electronic devices. However, corrosion resistance of oxide film varied significantly under the effect of waste heat generated by electronic devices. In this work, the physicochemical properties of oxide film on pure Sn and SnAg solders were disclosed through analysing the corresponding electrochemical impedance spectroscopy (EIS) data using measurement and power-law models. The resolved data from EIS were fully corresponded to X-ray photoelectron spectroscopy and transmission electron microscope observations, which highlight the EIS approaches in illustrating the oxide film properties on Sn-based solder. |
关键词 | A. Tin B. TEM C. Oxidation C. Passive films B. EIS |
资助者 | Fundamental Research Funds for the Central Universities |
DOI | 10.1016/j.corsci.2024.111930 |
收录类别 | SCI |
语种 | 英语 |
资助项目 | Fundamental Research Funds for the Central Universities[N2225005] |
WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
WOS类目 | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS记录号 | WOS:001204450200001 |
出版者 | PERGAMON-ELSEVIER SCIENCE LTD |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/185478 |
专题 | 中国科学院金属研究所 |
通讯作者 | Hao, Long |
作者单位 | 1.Chinese Acad Sci, Inst Met Res, Mat Corros & Protect Ctr, Shenyang 110016, Peoples R China 2.Northeastern Univ, Sch Met, Key Lab Ecol Met Multimet Mineral, Minist Educ, Shenyang 110819, Peoples R China |
推荐引用方式 GB/T 7714 | Qiao, Chuang,Wang, Youzhi,Jiang, Jinli,et al. Understanding the corrosion protection effect by surface oxide film to underlying Sn solder substrate under thermal exposure condition[J]. CORROSION SCIENCE,2024,230:13. |
APA | Qiao, Chuang.,Wang, Youzhi.,Jiang, Jinli.,Wu, Qiong.,Hao, Long.,...&An, Xizhong.(2024).Understanding the corrosion protection effect by surface oxide film to underlying Sn solder substrate under thermal exposure condition.CORROSION SCIENCE,230,13. |
MLA | Qiao, Chuang,et al."Understanding the corrosion protection effect by surface oxide film to underlying Sn solder substrate under thermal exposure condition".CORROSION SCIENCE 230(2024):13. |
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