Evolution of interfacial microstructure and oxides of CLAM steel by hot compression bonding

doi:10.1016/j.matchar.2024.113848

IMR OpenIR

	Evolution of interfacial microstructure and oxides of CLAM steel by hot compression bonding
	Bai, Yunfei 1,2; Wang, Jianqiang 3,4; Zhu, Gaofan 1,2; Nagasaka, Takuya 5; Shen, Jingjie 5; Sun, Mingyue 3,4; Huang, Qunying 1
通讯作者	Sun, Mingyue(mysun@imr.ac.cn) ; Huang, Qunying(qunying.huang@inest.cas.cn)
	2024-04-01
发表期刊	MATERIALS CHARACTERIZATION
ISSN	1044-5803
卷号	210 页码:12
摘要	The development of the joining process is essential for the application of China low activation martensitic (CLAM) steel as the structural material for fusion reactors. In the present study, the hot compression bonding (HCB) for CLAM steel was carried out under different parameters. The effects of different strain rates, temperatures, strains and holding time on the evolution of interfacial microstructure and oxides were investigated. Compressed at 1000 degrees C with 5% deformation, some micron-size continuous oxides distributed along the flat interface. The interfacial oxides were broken and decomposed as the deformation increased to 20%, their average size was reduced to 400 nm. With the bonding temperature increasing, more interfacial grain boundaries (IGBs) could cross the original bonding interface and flat interface became wavy. Compressed at 1000 degrees C/20%, the interfacial oxides consisted of fcc-structured spinel MnCr 2 O 4 and enriched in Si and Ta oxides. The MnCr 2 O 4 oxides would decompose preferentially after 0.5 h holding treatment at 1100 degrees C. Only a small number of oxides rich in Si and Ta elements remained at the original bonding area after 2 h holding treatment. Compressed at 1100 degrees C/20%, the bonding interface was completely replaced by the migrated grains after 2 h holding treatment and no large-size oxides could be observed. Moreover, the tensile strength and elongation at room temperature of the joint were comparable to those of the base material.
关键词	Hot compression bonding CLAM steel Interfacial oxide Interfacial grain boundary Holding time
资助者	International Partnership Program of Chinese Academy of Sciences ; National Key Research and Development Program ; National Natural Science Foundation of China
DOI	10.1016/j.matchar.2024.113848
收录类别	SCI
语种	英语
资助项目	International Partnership Program of Chinese Academy of Sciences[116134KYSB20200056] ; National Key Research and Development Program[2018YFA0702900] ; National Natural Science Foundation of China[52233017]
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Materials Science, Characterization & Testing
WOS记录号	WOS:001218564900001
出版者	ELSEVIER SCIENCE INC
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/185962
专题	中国科学院金属研究所
通讯作者	Sun, Mingyue; Huang, Qunying
作者单位	1.Chinese Acad Sci, Inst Nucl Energy Safety Technol, Hefei Inst Phys Sci, Hefei 230031, Anhui, Peoples R China 2.Univ Sci & Technol China, Hefei 230026, Anhui, Peoples R China 3.Chinese Acad Sci, Key Lab Nucl Mat & Safety Assessment, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 4.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China 5.Natl Inst Fus Sci, 322-6 Oroshi, Toki, Gifu 5095292, Japan
推荐引用方式 GB/T 7714	Bai, Yunfei,Wang, Jianqiang,Zhu, Gaofan,et al. Evolution of interfacial microstructure and oxides of CLAM steel by hot compression bonding[J]. MATERIALS CHARACTERIZATION,2024,210:12.
APA	Bai, Yunfei.,Wang, Jianqiang.,Zhu, Gaofan.,Nagasaka, Takuya.,Shen, Jingjie.,...&Huang, Qunying.(2024).Evolution of interfacial microstructure and oxides of CLAM steel by hot compression bonding.MATERIALS CHARACTERIZATION,210,12.
MLA	Bai, Yunfei,et al."Evolution of interfacial microstructure and oxides of CLAM steel by hot compression bonding".MATERIALS CHARACTERIZATION 210(2024):12.