Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy

doi:10.1016/j.addma.2024.104100

IMR OpenIR

	Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy
	Wang, Liqiang 1; Qu, Shuo 2; Fu, Huangliu 3; Zhou, Xin 4; Hu, Zongxin 2; Wen, Yaojie 5; Zhang, Baicheng 5; Gan, Bin 6; Song, Xu 2; Lu, Yang 7
通讯作者	Gan, Bin(ganb@szlab.ac.cn) ; Song, Xu(xsong@mae.cuhk.edu.hk) ; Lu, Yang(ylu1@hku.hk)
	2024-03-25
发表期刊	ADDITIVE MANUFACTURING
ISSN	2214-8604
卷号	84 页码:14
摘要	Employing a single strategy that overcomes the strength-ductility-conductivity trade-off in copper alloys has proven to be challenging. In this study, we introduced a novel heterogeneous nanoprecipitate-dislocation (HND) architecture in CuCrNb alloy consisting of a multi-modal core-shell grain structure and an interconnected dislocation network pinned by abundant nanoprecipitates. Our CuCrNb-HND alloy exhibited superior strength-ductility synergy at both room and elevated temperatures. In particular, aging treatment-induced highdensity coherent Cr secondary nanoprecipitates into the HND skeleton endowed the CuCrNb-HND450 alloy with a high tensile strength of over 1 GPa and a conductivity of similar to 50%, surpassing those of most of the reported additively manufactured copper alloys. An in situ transmission electron microscopy heating experiment revealed the superior thermal stability of the HND architecture. Hierarchical strengthening contributed to the enhancement of mechanical properties. At the micrometer scale, the harmonic grain structure with a strong fine-grained shell and a ductile coarse-grained core effectively improved mechanical properties by suppressing localized plastic deformation. At the nanometer scale, the synergistic effect of the nanoprecipitate-dislocation network further improved the alloy strength by slowing down dislocation movement. Overall, our proposed HND architecture provides an efficient pathway for developing high-strength and high-conductivity copper alloys.
关键词	Additive manufacturing Copper alloys Heterogeneous structure Nanoprecipitates In situ TEM
资助者	Hong Kong RGC General Research Fund ; Collaborative Research Fund ; Key R & D Programmes from the Science and Technology Department of Sichuan Province (Key Science & Technology Project) ; Changsha Municipal Science and Technology Bureau ; University Grants Committee (Hong Kong) Collaborative Research Fund ; Innovation and Technology Fund of the Government of the Hong Kong Special Administrative Region
DOI	10.1016/j.addma.2024.104100
收录类别	SCI
语种	英语
资助项目	Hong Kong RGC General Research Fund[11200623] ; Collaborative Research Fund[C7074-23G] ; Key R & D Programmes from the Science and Technology Department of Sichuan Province (Key Science & Technology Project)[2022YFSY0001] ; Changsha Municipal Science and Technology Bureau[kh2201035] ; University Grants Committee (Hong Kong) Collaborative Research Fund[C4074-22G] ; University Grants Committee (Hong Kong) Collaborative Research Fund[C4002-22Y] ; Innovation and Technology Fund of the Government of the Hong Kong Special Administrative Region[ITP/028/22TP]
WOS研究方向	Engineering ; Materials Science
WOS类目	Engineering, Manufacturing ; Materials Science, Multidisciplinary
WOS记录号	WOS:001240715400001
出版者	ELSEVIER
引用统计	被引频次：4[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/186847
专题	中国科学院金属研究所
通讯作者	Gan, Bin; Song, Xu; Lu, Yang
作者单位	1.City Univ Hong Kong, Dept Mech Engn, Hong Kong, Peoples R China 2.Chinese Univ Hong Kong, Dept Mech & Automation Engn, Hong Kong, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang, Peoples R China 4.Westfalische Wilhelms Univ, Phys Inst, D-48149 Munster, Germany 5.Univ Sci & Technol Beijing, Inst Adv Mat & Technol, Beijing Adv Innovat Ctr Mat Genome Engn, Beijing 100083, Peoples R China 6.Suzhou Lab, 388 Ruoshui St, Suzhou 215123, Jiangsu, Peoples R China 7.Univ Hong Kong, Dept Mech Engn, Hong Kong, Peoples R China
推荐引用方式 GB/T 7714	Wang, Liqiang,Qu, Shuo,Fu, Huangliu,et al. Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy[J]. ADDITIVE MANUFACTURING,2024,84:14.
APA	Wang, Liqiang.,Qu, Shuo.,Fu, Huangliu.,Zhou, Xin.,Hu, Zongxin.,...&Lu, Yang.(2024).Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy.ADDITIVE MANUFACTURING,84,14.
MLA	Wang, Liqiang,et al."Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy".ADDITIVE MANUFACTURING 84(2024):14.