High-temperature microstructure evolution and thermal stability of SiCf/ Ti60 composites

doi:10.1016/j.mtcomm.2024.109959

IMR OpenIR

	High-temperature microstructure evolution and thermal stability of SiCf/ Ti60 composites
	Gan, Zhicong 1,2; Wang, Yumin 1; Zhang, Xu 1; Yang, Lina 1; Zhang, Yuming 1; Jia, Qiuyue 1; Kong, Xu 1; Zhang, Guoxing 1; Yang, Qing 1; Yang, Rui 1
通讯作者	Wang, Yumin(yuminwang@imr.ac.cn) ; Yang, Rui(ryang@imr.ac.cn)
	2024-08-01
发表期刊	MATERIALS TODAY COMMUNICATIONS
卷号	40 页码:11
摘要	The microstructure evolution and thermal stability of continuous SiC fiber-reinforced Ti60 (SiCf/Ti60) composites at elevated temperatures have not been reported. The objective of this study was to conduct thermal exposure experiments of SiCf/Ti60 composites at 400 degrees C / 100 h, 600 degrees C / 100 h, and 800 degrees C / 100 h. The aim was to compare the interfacial and matrix microstructures under hot isostatic pressure (HIP) conditions and to assess their thermal stability. The results show that SiCf/Ti60 composites have excellent long-term thermal stability at 600 degrees C thermal exposure, short-term thermal stability at 800 degrees C thermal exposure and the thickness of the reaction layer (RL) increases to 1.27 mu m. From HIP to 800 degrees C thermal exposure, RL changes from finegrained TiC II discontinuous silicides II coarse-grained TiC to fine-grained TiC II near-continuous silicides II medium-grained TiC II coarse-grained TiC. Large-sized beta-Ti and S2 silicides precipitated in the matrix at 800 degrees C thermal exposure, where beta-Ti and alpha-Ti followed the Burgers orientation relationship (BOR), and the S2 exhibited a multitude of orientation relationships with both beta-Ti and alpha-Ti. Furthermore, it was demonstrated that thermal exposure resulted in a reduction in the dislocation density of the matrix. In particular, thermal exposure at 800 degrees C led to a decrease in the dislocation density of the matrix by 47 %. This observation provided a novel approach for the reduction of crystal defects in the matrix and the enhancement of the properties of SiCf/Ti composites.
关键词	Metal matrix composites Thermal exposure Thermal stability Microstructure
资助者	CAS Project for Young Scientists in Basic Research ; National Science and Technology Major Project of China ; National Natural Science Foundation of China ; Key Deployment Programme of the Chinese Academy of Sciences ; Basic Research Major Projects
DOI	10.1016/j.mtcomm.2024.109959
收录类别	SCI
语种	英语
资助项目	CAS Project for Young Scientists in Basic Research[YSBR-025] ; National Science and Technology Major Project of China[J2019-VI-0007-0121] ; National Natural Science Foundation of China[52101164] ; Key Deployment Programme of the Chinese Academy of Sciences[KGFZD-145-23-39] ; Basic Research Major Projects[JCKY2023203A003]
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:001291353300001
出版者	ELSEVIER
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/188967
专题	中国科学院金属研究所
通讯作者	Wang, Yumin; Yang, Rui
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Gan, Zhicong,Wang, Yumin,Zhang, Xu,et al. High-temperature microstructure evolution and thermal stability of SiCf/ Ti60 composites[J]. MATERIALS TODAY COMMUNICATIONS,2024,40:11.
APA	Gan, Zhicong.,Wang, Yumin.,Zhang, Xu.,Yang, Lina.,Zhang, Yuming.,...&Yang, Rui.(2024).High-temperature microstructure evolution and thermal stability of SiCf/ Ti60 composites.MATERIALS TODAY COMMUNICATIONS,40,11.
MLA	Gan, Zhicong,et al."High-temperature microstructure evolution and thermal stability of SiCf/ Ti60 composites".MATERIALS TODAY COMMUNICATIONS 40(2024):11.