A novel approach for the removal of oxide film to achieve seamless joining during hot-compression bonding

doi:10.1016/j.jmapro.2024.10.027

IMR OpenIR

	A novel approach for the removal of oxide film to achieve seamless joining during hot-compression bonding
	Zhao, Yong 1; Xu, Bin 2; Goel, Saurav 3,4; Xu, Haojie 1; Li, Kuo 2; Zlatanovic, Danka Labus 5; Sun, Mingyue 2; Guo, Jiang 1; Kang, Renke 1; Li, Dianzhong 2
通讯作者	Guo, Jiang(guojiang@dlut.edu.cn)
	2024-12-12
发表期刊	JOURNAL OF MANUFACTURING PROCESSES
ISSN	1526-6125
卷号	131 页码:2101-2117
摘要	The oxide film on the substrate surfaces can severely hinder the bonding quality during hot-compression bonding (HCB). To address the above issue, this investigation proposes a novel approach to enhance bonding quality by removing surface oxide film and encapsulating the interface to be bonded in sequence under vacuum. The principle of the approach was clarified, and an experiment platform used for implementing the approach was designed and developed. By considering 316H stainless steel as a testbed, the key parameter for laser ablation of the oxide films before HCB was determined. The HCB comparative experiments of substrates with or without treatment by the approach were carried out and the effectiveness of the approach was assessed by comparing the quality of bonding joints through interface morphologies and tensile properties. Results showed that a nearly seamless bond without thermal holding was achieved after adopting this approach. Further, it also showed improvement in the tensile properties both in elongation and the ultimate tensile strength (UTS). For instance, when using the proposed approach, the average UTS of 316H stainless steel joints improved from 371.17 MPa to 430.25 MPa whereas the average elongation increased from 26.41 % to 64.04 %. Although this investigation was directed to 316H stainless steel, the suggested approach can be applied to a wide range of other engineering materials to improve the joining quality.
关键词	Vacuum Laser treatment Oxide film Hot-compression bonding Seamless joining
资助者	National Key Research and Devel-opment Program ; Funds for Inter-national Cooperation and Exchange of the National Natural Science Foundation of China
DOI	10.1016/j.jmapro.2024.10.027
收录类别	SCI
语种	英语
资助项目	National Key Research and Devel-opment Program[2018YFA0702900] ; Funds for Inter-national Cooperation and Exchange of the National Natural Science Foundation of China[52311530080]
WOS研究方向	Engineering
WOS类目	Engineering, Manufacturing
WOS记录号	WOS:001338708000001
出版者	ELSEVIER SCI LTD
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/190879
专题	中国科学院金属研究所
通讯作者	Guo, Jiang
作者单位	1.Dalian Univ Technol, State Key Lab High Performance Precis Mfg, Dalian 116024, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 3.Univ Nottingham Ningbo China UNNC, China Beacons Excellence Res & Innovat Inst CBI, Ningbo, Peoples R China 4.Univ Petr & Energy Studies, Dept Mech Engn, Dehra Dun 248007, India 5.Tech Univ Ilmenau, Dept Prod Technol, D-98693 Ilmenau, Germany
推荐引用方式 GB/T 7714	Zhao, Yong,Xu, Bin,Goel, Saurav,et al. A novel approach for the removal of oxide film to achieve seamless joining during hot-compression bonding[J]. JOURNAL OF MANUFACTURING PROCESSES,2024,131:2101-2117.
APA	Zhao, Yong.,Xu, Bin.,Goel, Saurav.,Xu, Haojie.,Li, Kuo.,...&Li, Dianzhong.(2024).A novel approach for the removal of oxide film to achieve seamless joining during hot-compression bonding.JOURNAL OF MANUFACTURING PROCESSES,131,2101-2117.
MLA	Zhao, Yong,et al."A novel approach for the removal of oxide film to achieve seamless joining during hot-compression bonding".JOURNAL OF MANUFACTURING PROCESSES 131(2024):2101-2117.