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Thermodynamics-based sealing method for anodized aluminum used in semiconductor processing apparatuses
Wang, Yuhang1; Zhao, Yang1; Wang, Shaogang2; Chen, Ji3; Zhang, Tao1; Wang, Fuhui1
通讯作者Zhao, Yang(zhaoyang7402@mail.neu.edu.cn) ; Wang, Shaogang(wangshaogang@imr.ac.cn)
2025-05-01
发表期刊JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
卷号216页码:241-259
摘要A principle was proposed for designing a method to seal anodized aluminum used in semiconductor processing apparatuses. Thermodynamic calculations and Fick's second law were used to reveal trends in the metal ion deposition, deposition product stability, vapor pressures of halides for selected metal ions, the holding temperature, and time. Interactions between ion concentrations and the sealing temperature were also revealed. According to the design principles, anodized aluminum dipped in 1 mM Cr3 + ion solution and steam-sealed for 18 h exhibited the highest corrosion resistance when exposed to 5 wt.% HCl solution and HCl gas, verifying the designed results. (c) 2024 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
关键词Semiconductor Thermodynamic calculations Anodized aluminum Sealing method Design principle
资助者Program of the National Natural Science Foundation of China ; Young Elite Scientist Sponsorship Program Cast ; Basic Scientific Research Project of Liaoning Provincial Department of Education
DOI10.1016/j.jmst.2024.08.010
收录类别SCI
语种英语
资助项目Program of the National Natural Science Foundation of China[52371055] ; Young Elite Scientist Sponsorship Program Cast[YESS20200139] ; Basic Scientific Research Project of Liaoning Provincial Department of Education[JYTMS20230618]
WOS研究方向Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号WOS:001338549100001
出版者JOURNAL MATER SCI TECHNOL
引用统计
被引频次:2[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/190977
专题中国科学院金属研究所
通讯作者Zhao, Yang; Wang, Shaogang
作者单位1.Northeastern Univ, Corros & Protect Ctr, Shenyang 110819, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
3.Liaoning Petrochem Univ, Fushun 113001, Peoples R China
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GB/T 7714
Wang, Yuhang,Zhao, Yang,Wang, Shaogang,et al. Thermodynamics-based sealing method for anodized aluminum used in semiconductor processing apparatuses[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2025,216:241-259.
APA Wang, Yuhang,Zhao, Yang,Wang, Shaogang,Chen, Ji,Zhang, Tao,&Wang, Fuhui.(2025).Thermodynamics-based sealing method for anodized aluminum used in semiconductor processing apparatuses.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,216,241-259.
MLA Wang, Yuhang,et al."Thermodynamics-based sealing method for anodized aluminum used in semiconductor processing apparatuses".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 216(2025):241-259.
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