The metadynamic recrystallization behavior and kinetics of TP2 copper with columnar grains

doi:10.1016/j.mtcomm.2025.112213

IMR OpenIR

	The metadynamic recrystallization behavior and kinetics of TP2 copper with columnar grains
	Bai, Yu-Shi 1,2; Chen, Da-Yong 2; Song, Hong-Wu 2; Wang, Song-Wei 2; Chen, Shuai-Feng 2; Yu, Qi 3,4
通讯作者	Song, Hong-Wu(hwsong@imr.ac.cn)
	2025-04-01
发表期刊	MATERIALS TODAY COMMUNICATIONS
卷号	45 页码:13
摘要	In the brief preparation process of copper materials, cast billets undergo critical thermomechanical deformation and annealing steps, where understanding recrystallization behavior is essential for microstructure control. Hot deformation behavior and the metadynamic recrystallization (MDRX) characteristics of cast TP2 copper has been investigated by double-pass thermal compression tests in the temperature range of 700 similar to 800 degrees C, strain rate range of 0.1 similar to 10s(-1), strain range of 0.51 similar to 0.92 and inter-pass time of 0 similar to 60 s. Key findings reveal that the microstructural evolution of columnar-grained TP2 copper during thermal deformation and high-temperature holding processes exhibits pronounced differences compared to that of homogeneous equiaxed-grained copper typically employed in general studies. Discontinuous dynamic recrystallization (DDRX) and continuous dynamic recrystallization (CDRX) are the primary mechanisms governing microstructural evolution during hot deformation. The initial refinement of the average grain size followed by subsequent coarsening during the temperature maintenance process. The softening behaviors of MDRX are significantly accelerated with increasing compression temperature, strain rate, or first-pass strain. A kinetic model for MDRX, developed based on parameter-dependent softening fractions, demonstrates excellent agreement with experimental data. By manipulating the aforementioned parameters, the behavior of MDRX can be modulated to influence the microstructure following dynamic recrystallization (DRX) during hot deformation. This is particularly significant in facilitating secondary refinement, which is crucial for improving the microstructure and properties of TP2 tube products.
关键词	High-temperature deformation Columnar grains TP2 copper Metadynamic recrystallization Dynamic softening
资助者	Science and Technology Plan Project of Chang Zhou ; International Partnership Program of Chinese Academy of Sciences
DOI	10.1016/j.mtcomm.2025.112213
收录类别	SCI
语种	英语
资助项目	Science and Technology Plan Project of Chang Zhou[CQ20220057] ; International Partnership Program of Chinese Academy of Sciences[172GJHZ2022054GC]
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:001450315700001
出版者	ELSEVIER
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/192085
专题	中国科学院金属研究所
通讯作者	Song, Hong-Wu
作者单位	1.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 2.Chinese Acad Sci, Shi Changxu Innovat Ctr Adv Mat, Inst Met Res, Shenyang 110016, Peoples R China 3.JCC Proc Business Div, Nanchang 330096, Jiangxi, Peoples R China 4.Cent South Univ, Coll Mech & Elect Engn, Changsha 410083, Peoples R China
推荐引用方式 GB/T 7714	Bai, Yu-Shi,Chen, Da-Yong,Song, Hong-Wu,et al. The metadynamic recrystallization behavior and kinetics of TP2 copper with columnar grains[J]. MATERIALS TODAY COMMUNICATIONS,2025,45:13.
APA	Bai, Yu-Shi,Chen, Da-Yong,Song, Hong-Wu,Wang, Song-Wei,Chen, Shuai-Feng,&Yu, Qi.(2025).The metadynamic recrystallization behavior and kinetics of TP2 copper with columnar grains.MATERIALS TODAY COMMUNICATIONS,45,13.
MLA	Bai, Yu-Shi,et al."The metadynamic recrystallization behavior and kinetics of TP2 copper with columnar grains".MATERIALS TODAY COMMUNICATIONS 45(2025):13.