| Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy |
| X. H. Chen; J. J. Mao
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| 2011
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| 发表期刊 | Journal of Materials Engineering and Performance
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| ISSN | 1059-9495
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| 卷号 | 20期号:3页码:481-486 |
| 摘要 | By means of pulse electrodeposition technique, a nanocrystalline Cu-0.42at.%Bi alloy with a grain size down to similar to 10 nm was synthesized. The thermal stability of Cu-Bi electrodeposit was investigated using differential scanning calorimetry (DSC), x-ray diffraction (XRD), transmission electron microscopy (TEM), and hardness measurements. The temperature at which this material tends to become unstable was found to be 160 A degrees C. DSC revealed an exothermal peak between 190 and 300 A degrees C, caused by grain growth. It was observed that segregation of Bi at grain boundary has a considerable effect on the thermal stability of the Cu-Bi alloy. Tensile test showed the sample interestingly possesses a high strength of 760 MPa, while no plastic strain is detected. |
| 部门归属 | [chen, xianhua; mao, jianjun] chongqing univ, coll mat sci & engn, chongqing 400044, peoples r china. [chen, xianhua] chongqing univ, natl engn res ctr magnesium alloys, chongqing 400044, peoples r china. [chen, xianhua] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;chen, xh (reprint author), chongqing univ, coll mat sci & engn, chongqing 400044, peoples r china;xhchen@cqu.edu.cn
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| 关键词 | Grain Growth
Nanocrystalline Cu-bi
Segregation
Strength
Thermal
Stability
Nanocrystalline Copper
Segregation
Ni
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| URL | 查看原文
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| WOS记录号 | WOS:000288458500023
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| 引用统计 |
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| 文献类型 | 期刊论文
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| 条目标识符 | http://ir.imr.ac.cn/handle/321006/30265
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| 专题 | 中国科学院金属研究所
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推荐引用方式
GB/T 7714 |
X. H. Chen,J. J. Mao. Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy[J]. Journal of Materials Engineering and Performance,2011,20(3):481-486.
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| APA |
X. H. Chen,&J. J. Mao.(2011).Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy.Journal of Materials Engineering and Performance,20(3),481-486.
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| MLA |
X. H. Chen,et al."Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy".Journal of Materials Engineering and Performance 20.3(2011):481-486.
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