Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging

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	Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging
	P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
	2011
发表期刊	Philosophical Magazine Letters
ISSN	0950-0839
卷号	91 期号:6 页码:410-417
摘要	Microstructural investigations were performed on the interfacial reactions between eutectic SnIn solder and Cu substrate during reflowing at 433 K and solid-state aging at 373 K. Cu(2)(In,Sn) was identified as the only intermetallic compound (IMC) at the interface, which consists of two sublayers with different morphology, a fine-grained sublayer at the Cu side and a coarse-grained sublayer at the solder side. During solid-state aging, voids were found between these two Cu(2)(In,Sn) sublayers but not at the substrate interface, which is also attributed to the Kirkendall effect considering the different diffusion fluxes of Sn or In and Cu atoms in different sublayers.
部门归属	[shang, p. j.; liu, z. q.; li, d. x.; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, pj (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;pjshang@imr.ac.cn zqliu@imr.ac.cn
关键词	Diffusion Intermetallic Compounds Snin Solder Interfaces Kirkendall Void Cu-sn Interface Reliability Diffusion Systems Growth
URL	查看原文
WOS记录号	WOS:000290899700004
引用统计	被引频次：18[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/30642
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	P. J. Shang,Z. Q. Liu,D. X. Li,et al. Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging[J]. Philosophical Magazine Letters,2011,91(6):410-417.
APA	P. J. Shang,Z. Q. Liu,D. X. Li,&J. K. Shang.(2011).Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging.Philosophical Magazine Letters,91(6),410-417.
MLA	P. J. Shang,et al."Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging".Philosophical Magazine Letters 91.6(2011):410-417.