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The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges
H. Wang; D. S. Xu; R. Yang; P. Veyssiere
2011
发表期刊Acta Materialia
ISSN1359-6454
卷号59期号:1页码:19-29
摘要Ledge expansion and the concomitant growth of a stacking fault tetrahedron (SFT) are investigated in Al and Cu by molecular dynamics (MD) simulations by addition of vacancy rods with selected lengths Ledge expansion is largely governed by the site preference of vacancies on the SFT edges resulting in distinct stable ledged SFTs Both edge- and corner-facing ledge configurations may be adopted The growth of SFTs, especially large ones, is controlled by thermal agitation The mobile part of the ledges consists of a dipole of Shockley partials generally oriented in the 60 degrees mixed orientation that move in a thermally activated manner, reflecting a certain core reorganization of the Shockley dipole (C) 2010 Acta Materialia Inc Published by Elsevier Ltd All rights reserved
部门归属[wang, h.; xu, d. s.; yang, r.] chinese acad sci, inst met res, shenyang 110016, peoples r china. [veyssiere, p.] off natl etud & rech aerosp, lem, cnrs, f-92322 chatillon, france.;wang, h (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china
关键词Stacking Fault Tetrahedron Growth Ledge Mechanism Molecular Dynamics Simulations Shockley Dipole Vacancy Clusters Quenched Gold Fcc Metals Molecular-dynamics Glissile Dislocations Irradiated Materials Elastic Interaction Point-defects Part i Copper
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WOS记录号WOS:000284789200003
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被引频次:21[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/30725
专题中国科学院金属研究所
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H. Wang,D. S. Xu,R. Yang,et al. The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges[J]. Acta Materialia,2011,59(1):19-29.
APA H. Wang,D. S. Xu,R. Yang,&P. Veyssiere.(2011).The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges.Acta Materialia,59(1),19-29.
MLA H. Wang,et al."The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges".Acta Materialia 59.1(2011):19-29.
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