| Interfacial diffusion in a nanostructured Cu produced by means of dynamic plastic deformation | |
| H. L. Wang; Z. B. Wang; K. Lu | |
| 2011 | |
| 发表期刊 | Acta Materialia
 |
| ISSN | 1359-6454 |
| 卷号 | 59期号:4页码:1818-1828 |
| 摘要 | A nanostructured pure Cu sample consisting of nano-scale twin bundles and nano-sized grains was produced by means of dynamic plastic deformation (DPD) at cryogenic temperature. The apparent activation energy for recrystallization of the nanostructured Cu was determined, being similar to 57 kJ mol(-1). Interfacial diffusion of Zn in the nanostructure was investigated using secondary ion mass spectrometry within the temperature range 358-463 K, in which the volume diffusion is negligible. The measured penetration profiles showed two distinct sections with different slopes, owing to the direct and independent diffusion fluxes along twin boundaries (TB) and grain boundaries (GB). The determined GB diffusivity is similar to 2 orders of magnitude higher than the TB diffusivity. Relative to the diffusivities and free energies of GB and incoherent TB in coarse-grained Cu, both values in the DPD Cu sample are slightly higher at temperatures <373 K, and approach comparable values at higher temperatures. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 部门归属 | [wang, h. l.; wang, z. b.; lu, k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;wang, zb (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;zbwang@imr.ac.cn lu@imr.ac.cn |
| 关键词 | Nanostructured Material Dynamic Plastic Deformation Diffusion Grain Boundaries Twin Boundaries Grain-boundary Diffusion Mechanical Attrition Treatment Tilt Boundaries Copper Alloy Temperatures Nucleation Dependence Energies Scale |
| URL | 查看原文 |
| WOS记录号 | WOS:000287265100049 |
| 引用统计 | |
| 文献类型 | 期刊论文 |
| 条目标识符 | http://ir.imr.ac.cn/handle/321006/30726 |
| 专题 | 中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. L. Wang,Z. B. Wang,K. Lu. Interfacial diffusion in a nanostructured Cu produced by means of dynamic plastic deformation[J]. Acta Materialia,2011,59(4):1818-1828. |
| APA | H. L. Wang,Z. B. Wang,&K. Lu.(2011).Interfacial diffusion in a nanostructured Cu produced by means of dynamic plastic deformation.Acta Materialia,59(4),1818-1828. |
| MLA | H. L. Wang,et al."Interfacial diffusion in a nanostructured Cu produced by means of dynamic plastic deformation".Acta Materialia 59.4(2011):1818-1828. |
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