Scaling of reliability of gold interconnect lines subjected to alternating current | |
M. Wang; B. Zhang; G. P. Zhang; C. S. Liu | |
2011 | |
发表期刊 | Applied Physics Letters
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ISSN | 0003-6951 |
卷号 | 99期号:1 |
摘要 | We present an investigation of damage morphologies of small-scale gold interconnect lines subjected to thermal fatigue strain generated by alternating current. Fractal dimension analysis reveals a general scaling relation between the critical strain range causing thermal fatigue damage and the ratio of the width to the thickness of the metal line. Such the scaling rule may be useful in controlling reliability of the metal interconnect lines subjected to long-term thermal cyclic strain. (C) 2011 American Institute of Physics. [doi: 10.1063/1.3609779] |
部门归属 | [wang, m.; zhang, g. p.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [wang, m.; zhang, b.; liu, c. s.] northeastern univ, sch met & mat, minist educ, key lab anisotropy & texture mat, shenyang 110819, peoples r china.;wang, m (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;zhangb@smm.neu.edu.cn gpzhang@imr.ac.cn |
关键词 | Thermal Fatigue Damage Thin Metal-films Fracture Surfaces Behavior Failure |
URL | 查看原文 |
WOS记录号 | WOS:000292639200023 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/30733 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | M. Wang,B. Zhang,G. P. Zhang,et al. Scaling of reliability of gold interconnect lines subjected to alternating current[J]. Applied Physics Letters,2011,99(1). |
APA | M. Wang,B. Zhang,G. P. Zhang,&C. S. Liu.(2011).Scaling of reliability of gold interconnect lines subjected to alternating current.Applied Physics Letters,99(1). |
MLA | M. Wang,et al."Scaling of reliability of gold interconnect lines subjected to alternating current".Applied Physics Letters 99.1(2011). |
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