Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing

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	Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing
	Q. K. Zhang; J. Tan; Z. F. Zhang
	2011
发表期刊	Journal of Applied Physics
ISSN	0021-8979
卷号	110 期号:1
摘要	In this study, the shear fracture behaviors of the Cu(6)Sn(5) grains at the Sn-4Ag/Cu interface were studied by indentation test; the fracture mechanisms and shear strength were characterized through analyzing the indentation curves and fracture morphologies. Experimental results reveal that shear fractures of the Cu(6)Sn(5) grains occur at the foundation or the center portion, depending on their size and shape, and there are bursts on the force-depth curves corresponding to the fracture. The shear fracture strength of the Cu(6)Sn(5) grains fractured at their center portion is close to the shear strength of the Cu(6)Sn(5) intermetallic compounds, and its average value is about 670 MPa. (C) 2011 American Institute of Physics. [doi:10.1063/1.3603032]
部门归属	[zhang, q. k.; tan, j.; zhang, z. f.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Lead-free Solders Mechanical-properties Interfacial Reactions Deformation-behavior Joints Nanoindentation Sn Metallization Toughness Cu3sn
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/30901
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. K. Zhang,J. Tan,Z. F. Zhang. Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing[J]. Journal of Applied Physics,2011,110(1).
APA	Q. K. Zhang,J. Tan,&Z. F. Zhang.(2011).Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing.Journal of Applied Physics,110(1).
MLA	Q. K. Zhang,et al."Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing".Journal of Applied Physics 110.1(2011).