In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates

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	In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates
	Q. K. Zhang; Z. F. Zhang
	2011
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093
卷号	530 页码:452-461
摘要	The fracture behaviors of the interfacial Cu-Sn intermetallic compound (IMC) layers induced by deformation of the Cu substrates were investigated in this study. The IMC layers at the Sn-Ag/Cu single crystal and the Sn-Ag/cold-drawn Cu interfaces were driven to deform synchronously with the Cu substrates, and their fracture morphologies were in situ observed. The results show that fractures in the IMC layers at both of the two interfaces occur shortly after the Cu yields, and the cracks correlate well with the slip bands in the Cu substrates. In micro-scale, the fractures are predicated to be induced by dislocation pile-up. After the Cu substrates yield, the dislocations in them slip toward their surfaces. Since the dislocations cannot get across the IMC/Cu interface, they pile-up at the interface and generate a high cumulative stress ahead the pile-up group. When the cumulative stress reaches the fracture strength of the IMC, fractures inside the IMC layer occur. Before yielding of the Cu substrates, the IMC layer can withstand a high strain without fracture, because there are thin gaps between the IMC grains that can be opened to accommodate deformation. The yield behavior of the Cu substrate is the major influencing factor on the fracture behaviors of the interfacial IMC layers. Thermal aging makes the IMC layers thicker, more compact and easier to fracture. (C) 2011 Elsevier B.V. All rights reserved.
部门归属	[zhang, q. k.; zhang, z. f.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	In-situ Observation Intermetallic Compounds Interface Fracture Dislocation Pile-up Cumulative Stress Lead-free Solders Intermetallic Compounds Mechanical-properties Fatigue Damage Joints Sn-3.5ag Polycrystalline Interfaces Morphology Evolution
URL	查看原文
WOS记录号	WOS:000298311100058
引用统计	被引频次：14[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/30902
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. K. Zhang,Z. F. Zhang. In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2011,530:452-461.
APA	Q. K. Zhang,&Z. F. Zhang.(2011).In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,530,452-461.
MLA	Q. K. Zhang,et al."In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 530(2011):452-461.