Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining

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	Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining
	X. F. Zhang; H. Y. Liu; J. D. Guo; J. K. Shang
	2011
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	27 期号:11 页码:1072-1076
摘要	Plastic prestraining was applied to a solder interconnect to introduce internal defects such as dislocations in order to investigate the interaction of dislocations with electromigration damage. Above a critical prestrain, Bi interfacial segregation to the anode, a clear indication of electromigration damage in SnBi solder interconnect, was effectively prevented. Such an inhibiting effect is apparently contrary to the common notion that dislocations often act as fast diffusion paths. It is suggested that the dislocations introduced by plastic prestraining acted as sinks for vacancies in the early stage of the electromigration process, but as the vacancies accumulated at the dislocations, climb of those dislocations prompted recovery of the deformed samples under current stressing, greatly decreasing the density Of dislocation And vacancy in the solder, leading to slower diffusion of Bi atoms.
部门归属	[zhang, x. f.; liu, h. y.; guo, j. d.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jkshang@imr.ac.cn
关键词	Electromigration Interfacial Segregation Prestrain Dislocation Vacancy Electric-current Segregation Bi
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WOS记录号	WOS:000298198900019
引用统计	被引频次：17[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/30922
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	X. F. Zhang,H. Y. Liu,J. D. Guo,et al. Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining[J]. Journal of Materials Science & Technology,2011,27(11):1072-1076.
APA	X. F. Zhang,H. Y. Liu,J. D. Guo,&J. K. Shang.(2011).Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining.Journal of Materials Science & Technology,27(11),1072-1076.
MLA	X. F. Zhang,et al."Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining".Journal of Materials Science & Technology 27.11(2011):1072-1076.