Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nano structured Cu-Al alloys subjected to plastic deformation

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	Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nano structured Cu-Al alloys subjected to plastic deformation; Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nano structured Cu-Al alloys subjected to plastic deformation
	Y. Zhang; N. R. Tao; K. Lu
	2011 ; 2011
发表期刊	Acta Materialia ; Acta Materialia
ISSN	1359-6454 ; 1359-6454
卷号	59 期号:15 页码:6048-6058
摘要	Nanostructured Cu-Al alloys with different stacking fault energies (SFEs) corresponding to Al concentrations in a range of 0 4.5 wt.% are prepared by means of plastic deformation. Effects of SFE, strain rate and temperature on microstructure characteristics and strength have been systematically investigated in the Cu-Al alloys. It was found that the deformation occurs mainly by twinning at the nanoscale in all samples subjected to dynamic plastic deformation at liquid nitrogen temperature. In the quasi-static compression process at room temperature, dislocation slip dominates the plastic deformation when the SFE is higher than 50 mJ m(-2). With decreasing SFE, twinning becomes the dominant deformation mechanism. A map of deformation modes and corresponding strain-induced microstructures is drawn in the SFE-processing parameters space for the Cu-Al alloys. In both sets of deformation mode, twinning is obviously enhanced by decreasing the SFE, resulting in smaller twin/matrix (T/M) lamella thickness and grain sizes. Consequently, an obvious strength elevation is induced by the size effects of grains and T/M lamellae with lower SFEs. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.; Nanostructured Cu-Al alloys with different stacking fault energies (SFEs) corresponding to Al concentrations in a range of 0 4.5 wt.% are prepared by means of plastic deformation. Effects of SFE, strain rate and temperature on microstructure characteristics and strength have been systematically investigated in the Cu-Al alloys. It was found that the deformation occurs mainly by twinning at the nanoscale in all samples subjected to dynamic plastic deformation at liquid nitrogen temperature. In the quasi-static compression process at room temperature, dislocation slip dominates the plastic deformation when the SFE is higher than 50 mJ m(-2). With decreasing SFE, twinning becomes the dominant deformation mechanism. A map of deformation modes and corresponding strain-induced microstructures is drawn in the SFE-processing parameters space for the Cu-Al alloys. In both sets of deformation mode, twinning is obviously enhanced by decreasing the SFE, resulting in smaller twin/matrix (T/M) lamella thickness and grain sizes. Consequently, an obvious strength elevation is induced by the size effects of grains and T/M lamellae with lower SFEs. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[zhang, y.; tao, n. r.; lu, k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;tao, nr (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;nrtao@imr.ac.cn lu@imr.ac.cn ; [zhang, y.; tao, n. r.; lu, k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;tao, nr (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;nrtao@imr.ac.cn lu@imr.ac.cn
关键词	Cu-al Alloys Cu-al Alloys Stacking Fault Energy Stacking Fault Energy Plastic Deformation Plastic Deformation Nanostructures Nanostructures Mechanical Properties Mechanical Properties High-pressure Torsion High-pressure Torsion Mechanical Attrition Treatment Mechanical Attrition Treatment Ultrafine-grained Ultrafine-grained Metals Metals Nanostructured Metals Nanostructured Metals Nanocrystalline Cu Nanocrystalline Cu Tensile Properties Tensile Properties Dynamic Recovery Dynamic Recovery Surface-layer Surface-layer Scale Twins Scale Twins Copper Copper
URL	查看原文 ; 查看原文
WOS记录号	WOS:000294086900018 ; WOS:000294086900018
引用统计	被引频次：147[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/30927
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Y. Zhang,N. R. Tao,K. Lu. Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nano structured Cu-Al alloys subjected to plastic deformation, Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nano structured Cu-Al alloys subjected to plastic deformation[J]. Acta Materialia, Acta Materialia,2011, 2011,59, 59(15):6048-6058, 6048-6058.
APA	Y. Zhang,N. R. Tao,&K. Lu.(2011).Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nano structured Cu-Al alloys subjected to plastic deformation.Acta Materialia,59(15),6048-6058.
MLA	Y. Zhang,et al."Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nano structured Cu-Al alloys subjected to plastic deformation".Acta Materialia 59.15(2011):6048-6058.