Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders

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	Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders
	H. F. Zou; H. J. Yang; Z. F. Zhang
	2011
发表期刊	Materials Chemistry and Physics
ISSN	0254-0584
卷号	131 期号:1-2 页码:190-198
摘要	During the reflowing procedure, the Cu concentration in the solder affects the coarsening mechanisms of intermetallic compound (IMC) grains. For the Sn3Cu solder, the mean radius of the IMC grains was proportional to the cube root of the reflowing time; while it follows the square root relation with the reflowing time for the SnAgCu and Sn solders. It is proposed that the flux from the substrate was only consumed to coarsen the IMC grains for Sn3Cu solder, while it was separated into two fluxes for the SnAgCu and Sn solders at the reflowing initial procedure. For the Sn3.8Ag0.7Cu/Cu and Sn/Cu couples, the size distribution of the IMC grains well agrees with the modified flux driven ripening (FDR) model when the value of r/(r) is above 1; while it would closely match with Marqusee and Ross analysis when the value of r/(r) is below 1. For Sn3Cu/Cu couple, the size distribution of IMC grains shows good agreement with the FDR model. However, for SnPb/poly-Cu, during the solid-state aging procedure, the mean radius of the IMC grains was proportional to the cube root of the aging time. And the size distribution of IMC grains is well consistent with the FDR model. (C) 2011 Elsevier B.V. All rights reserved.
部门归属	[zou, h. f.; yang, h. j.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [zou, h. f.] capital aerosp machinery co, beijing 100076, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Intermetallic Compounds Nucleation Interface Ebsd Interfacial Reactions Microstructure Metallization Substrate Kinetics Ag
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31002
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,H. J. Yang,Z. F. Zhang. Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders[J]. Materials Chemistry and Physics,2011,131(1-2):190-198.
APA	H. F. Zou,H. J. Yang,&Z. F. Zhang.(2011).Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders.Materials Chemistry and Physics,131(1-2),190-198.
MLA	H. F. Zou,et al."Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders".Materials Chemistry and Physics 131.1-2(2011):190-198.