Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples

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	Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples
	H. F. Zou; Q. K. Zhang; Z. F. Zhang
	2011
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	40 期号:7 页码:1542-1548
摘要	In the current study, the interfacial microstructures of Sn-Ag/Cu-X alloy (X = Ag, Sn or Zn) couples were investigated. The experimental results confirm that addition of Ag or Zn can effectively suppress the growth of the Cu(3)Sn layer, while addition of Sn accelerates the growth of the Cu(3)Sn layer. Meanwhile, the formation of voids is effectively suppressed by alloying the Cu substrate. The disappearance of voids and the absence of the Cu(3)Sn layer were well explained in terms of the phase diagram and the diffusion flux: the Cu(3)Sn phase is a nonequilibrium phase based on the Sn-Cu-Zn ternary phase diagram, since a high-Zn region is formed at the Cu(6)Sn(5)/Cu-Zn alloy interface; in addition, the high Sn diffusion flux in the Cu(6)Sn(5) can suppress the growth of Cu(3)Sn and the formation of voids.
部门归属	[zou, h. f.; zhang, q. k.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [zou, h. f.] capital aerosp machinery co, beijing 100076, peoples r china.;zou, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Cu(3)Sn Void Cu Alloys Intermetallic Compound (Imc) Interfacial Reaction Free Solders Mechanisms Diffusion Strength Joints
URL	查看原文
WOS记录号	WOS:000291041100010
引用统计	被引频次：7[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31003
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,Q. K. Zhang,Z. F. Zhang. Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples[J]. Journal of Electronic Materials,2011,40(7):1542-1548.
APA	H. F. Zou,Q. K. Zhang,&Z. F. Zhang.(2011).Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples.Journal of Electronic Materials,40(7),1542-1548.
MLA	H. F. Zou,et al."Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples".Journal of Electronic Materials 40.7(2011):1542-1548.