Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature

IMR OpenIR

	Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature; Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature
	H. F. Zou; Q. K. Zhang; Z. F. Zhang
	2011 ; 2011
发表期刊	Journal of Materials Research ; Journal of Materials Research
ISSN	0884-2914 ; 0884-2914
卷号	26 期号:3 页码:449-454
摘要	The current study revealed the effects of reflow temperature and the reflow time on the interfacial embrittlement of SnBi/Cu joints. When the reflow temperature is below 220 degrees C, the joints reflowed for 150 min often fail in brittle mode because the Bi atoms from the SnBi solder easily segregated at the Cu(3)Sn/Cu interface. In contrast, Bi embrittlement did not occur for joints reflowed at above 260 degrees C for 150 min because the Bi particles were frozen in the Cu(3)Sn layer during the formation of intermetallic compounds (IMC) at the initial reflow stage, mainly located at the Cu(3)Sn grain boundary. It is interesting to note that the Bi embrittlement did occur when the joints were reflowed at above 260 degrees C for 250 min, which should be attributed to Bi diffusion. It is concluded that the Bi particles are frozen in the Cu(3)Sn layer with increasing reflow temperature, that cannot eliminate Bi embrittlement, and can only delay the occurrence of Bi embrittlement.; The current study revealed the effects of reflow temperature and the reflow time on the interfacial embrittlement of SnBi/Cu joints. When the reflow temperature is below 220 degrees C, the joints reflowed for 150 min often fail in brittle mode because the Bi atoms from the SnBi solder easily segregated at the Cu(3)Sn/Cu interface. In contrast, Bi embrittlement did not occur for joints reflowed at above 260 degrees C for 150 min because the Bi particles were frozen in the Cu(3)Sn layer during the formation of intermetallic compounds (IMC) at the initial reflow stage, mainly located at the Cu(3)Sn grain boundary. It is interesting to note that the Bi embrittlement did occur when the joints were reflowed at above 260 degrees C for 250 min, which should be attributed to Bi diffusion. It is concluded that the Bi particles are frozen in the Cu(3)Sn layer with increasing reflow temperature, that cannot eliminate Bi embrittlement, and can only delay the occurrence of Bi embrittlement.
部门归属	[zou, h. f.; zhang, q. k.; zhang, z. f.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn ; [zou, h. f.; zhang, q. k.; zhang, z. f.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Solder Joints Solder Joints Interfacial Embrittlement Interfacial Embrittlement Single-crystal Single-crystal Interconnect Interconnect Segregation Segregation Tensile Tensile Bismuth Bismuth
URL	查看原文 ; 查看原文
WOS记录号	WOS:000292823200013 ; WOS:000292823200013
引用统计	被引频次：20[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31004
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,Q. K. Zhang,Z. F. Zhang. Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature, Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature[J]. Journal of Materials Research, Journal of Materials Research,2011, 2011,26, 26(3):449-454, 449-454.
APA	H. F. Zou,Q. K. Zhang,&Z. F. Zhang.(2011).Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature.Journal of Materials Research,26(3),449-454.
MLA	H. F. Zou,et al."Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature".Journal of Materials Research 26.3(2011):449-454.