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Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu) (vol 108, 103518, 2010)
H. F. Zou; Z. F. Zhang
2011
Source PublicationJournal of Applied Physics
ISSN0021-8979
Volume109Issue:2
description.department[zou, h. f.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [zou, h. f.] elect component lab, guangzhou 51060, guangdong, peoples r china.;zou, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
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WOS IDWOS:000286896400112
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/31005
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
H. F. Zou,Z. F. Zhang. Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu) (vol 108, 103518, 2010)[J]. Journal of Applied Physics,2011,109(2).
APA H. F. Zou,&Z. F. Zhang.(2011).Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu) (vol 108, 103518, 2010).Journal of Applied Physics,109(2).
MLA H. F. Zou,et al."Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu) (vol 108, 103518, 2010)".Journal of Applied Physics 109.2(2011).
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