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Electrophoretic Deposition of Ti(3)Si(Al)C(2) from Aqueous Suspension
Y. Liang; Z. Q. Sun; J. X. Chen; X. X. Liu; Y. C. Zhou
2010
发表期刊Journal of the American Ceramic Society
ISSN0002-7820
卷号93期号:7页码:1916-1921
摘要Ti(3)Si(Al)C(2) films were electrophoretically deposited at 3 V on indium-tin-oxide (ITO) conductive glass from Ti(3)Si(Al)C(2) aqueous suspension with 1 vol% solid loading at pH 9 in the absence of any dispersant. The surface morphology, cross section microstructure, and preferred orientation of the films were investigated by scanning electron microscopy and X-ray diffraction. The as-deposited Ti(3)Si(Al)C(2) films exhibited (00l) preferred orientation and the thickness can be controlled by the deposition-drying-deposition method. These results demonstrate that electrophoretic deposition is a simple and feasible method to prepare MAX-phases green films at room temperature.
部门归属[liang, ying; sun, ziqi; chen, jixin; zhou, yanchun] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [liang, ying; liu, xiaoxia] northeastern univ, dept chem, shenyang 110004, peoples r china. [sun, ziqi] chinese acad sci, grad sch, beijing 100039, peoples r china.;zhou, yc (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;yczhou@imr.ac.cn
关键词Chemical-vapor-deposition Oxidation Resistance Gas-mixtures Thin-films c System Ti3sic2 Ceramics Coatings Ti2alc Steel
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文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/31255
专题中国科学院金属研究所
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Y. Liang,Z. Q. Sun,J. X. Chen,et al. Electrophoretic Deposition of Ti(3)Si(Al)C(2) from Aqueous Suspension[J]. Journal of the American Ceramic Society,2010,93(7):1916-1921.
APA Y. Liang,Z. Q. Sun,J. X. Chen,X. X. Liu,&Y. C. Zhou.(2010).Electrophoretic Deposition of Ti(3)Si(Al)C(2) from Aqueous Suspension.Journal of the American Ceramic Society,93(7),1916-1921.
MLA Y. Liang,et al."Electrophoretic Deposition of Ti(3)Si(Al)C(2) from Aqueous Suspension".Journal of the American Ceramic Society 93.7(2010):1916-1921.
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