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The effect of Cu addition on the electrochemical corrosion and passivation behavior of stainless steels
E. E. Oguzie; J. B. Li; Y. Q. Liu; D. M. Chen; Y. Li; K. Yang; F. H. Wang
2010
发表期刊Electrochimica Acta
ISSN0013-4686
卷号55期号:17页码:5028-5035
摘要The effect of Cu addition on the electrochemical corrosion behavior of austenitic, ferritic and martensitic stainless steels in both the active and passive state was investigated by potentiodynamic polarization and electrochemical impedance spectroscopy in 0.1 M H(2)SO(4). The semiconducting properties of the passive films were investigated by capacitance measurements by using the Mott-Schottky approach. Cu addition generally improved corrosion resistance and facilitated passivation but did not notably affect the resistance of the passive films. Capacitance results revealed that the passive films behave as n-type and p-type semiconductors at potentials below and above the flatband potential, respectively. Cu addition caused an increase in the donor and acceptor densities, which we have attempted to correlate with the passive film stability. (C) 2010 Elsevier Ltd. All rights reserved.
部门归属[oguzie, emeka e.] fed univ technol owerri, dept chem, electrochem & mat sci res lab, owerri, nigeria. [oguzie, emeka e.; li, jibiao; li, ying; wang, fuhui] chinese acad sci, inst met res, state key lab corros & protect, shenyang 110015, peoples r china. [liu, yongqian; chen, demin; yang, ke] chinese acad sci, inst met res, ctr engn mat, shenyang 110016, peoples r china.;oguzie, ee (reprint author), fed univ technol owerri, dept chem, electrochem & mat sci res lab, pmb 1526, owerri, nigeria;oguziemeka@yahoo.com liying@imr.ac.cn
关键词Cu Addition Corrosion Passivity Semiconductor Properties Mott-schottky Equation Iron-chromium-alloys Anodic-dissolution Antibacterial Properties Impedance Measurements Electronic-structure Acid-solutions Copper Films Passivity Chloride
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WOS记录号WOS:000278637200031
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被引频次:156[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/31395
专题中国科学院金属研究所
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GB/T 7714
E. E. Oguzie,J. B. Li,Y. Q. Liu,et al. The effect of Cu addition on the electrochemical corrosion and passivation behavior of stainless steels[J]. Electrochimica Acta,2010,55(17):5028-5035.
APA E. E. Oguzie.,J. B. Li.,Y. Q. Liu.,D. M. Chen.,Y. Li.,...&F. H. Wang.(2010).The effect of Cu addition on the electrochemical corrosion and passivation behavior of stainless steels.Electrochimica Acta,55(17),5028-5035.
MLA E. E. Oguzie,et al."The effect of Cu addition on the electrochemical corrosion and passivation behavior of stainless steels".Electrochimica Acta 55.17(2010):5028-5035.
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