Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques

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	Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques
	J. Ran; J. Z. Zhang; W. Q. Yao; Y. T. Wei
	2010
发表期刊	Applied Surface Science
ISSN	0169-4332
卷号	256 期号:23 页码:7010-7017
摘要	Cu film and Ti/Cu film on polyimide substrate were prepared by ion implantation and ion beam assisted deposition (IBAD) techniques. Three-dimension white-light interfering profilometer was used to measure thickness of each film. The thickness of the Cu film and Ti/Cu film ranged between 490 nm and 640 nm. The depth profile, surface morphology, roughness, adhesion, nanohardness, and modulus of the Cu and Ti/Cu films were measured by scanning Auger nanoprobe (SAN), atomic force microscopy (AFM), and nanoindenter, respectively. The polyimide substrates irradiated with argon ions were analyzed by scanning electron microscopy (SEM) and AFM. The results suggested that both the Cu film and Ti/Cu film were of good adhesion with polyimide substrate, and ion beam techniques were suitable to prepare thin metal film on polyimide. (C) 2010 Elsevier B.V. All rights reserved.
部门归属	[ran, jie; zhang, jizhong; wei, yueteng] tsinghua univ, dept mat sci & engn, adv mat lab, beijing 100084, peoples r china. [zhang, jizhong] chinese acad sci, int ctr mat phys, shenyang 110016, peoples r china. [yao, wenqing] tsinghua univ, anal ctr, beijing 100084, peoples r china.;zhang, jz (reprint author), tsinghua univ, dept mat sci & engn, adv mat lab, beijing 100084, peoples r china;zjz@mail.tsinghua.edu.cn
关键词	Metal Film Polyimide Ion implantatIon Ion Beam Assisted depositIon Adhesion Assisted Deposition Adhesion Properties Copper-films Thin-film Implantation Limitations Substrate Polymers
URL	查看原文
WOS记录号	WOS:000279592200013
引用统计	被引频次：12[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31419
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	J. Ran,J. Z. Zhang,W. Q. Yao,et al. Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques[J]. Applied Surface Science,2010,256(23):7010-7017.
APA	J. Ran,J. Z. Zhang,W. Q. Yao,&Y. T. Wei.(2010).Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques.Applied Surface Science,256(23),7010-7017.
MLA	J. Ran,et al."Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques".Applied Surface Science 256.23(2010):7010-7017.