IMR OpenIR
Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints
X. J. Wang; Q. L. Zeng; Q. S. Zhu; Z. G. Wang; J. K. Shang
2010
发表期刊Journal of Materials Science & Technology
ISSN1005-0302
卷号26期号:8页码:737-742
摘要Effects of electromigration on microstructure, shear strength, and fracture behavior of solder joints were investigated by single-ball shear samples of eutectic Sn-3.8Ag-0.7Cu (SAC) joined by Cu plates at two sides. The electromigratipn tests were conducted at a current density of about 1.1x10(3) A/cm(2) and a working temperature of about 83 degrees C. The results showed that the shear strength and flow stress decreased greatly after current stressing. Such a decrease was associated with no significant loss of the fracture strain at short electromigration but a great reduction in the fracture strain after long-term current stressing. The variation of the fracture strain with the electromigration time was shown to result from the shift of the fracture surface from the center of the solder towards the intermetallic compound (IMC) interface at the cathode.
部门归属[wang, x. j.; zeng, q. l.; zhu, q. s.; wang, z. g.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jkshang@illinois.edu
关键词Strength Fracture Strain Voids Solder Al Interconnects Electromigration Growth Lines Sn
URL查看原文
WOS记录号WOS:000281708400012
引用统计
被引频次:17[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/31526
专题中国科学院金属研究所
推荐引用方式
GB/T 7714
X. J. Wang,Q. L. Zeng,Q. S. Zhu,et al. Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints[J]. Journal of Materials Science & Technology,2010,26(8):737-742.
APA X. J. Wang,Q. L. Zeng,Q. S. Zhu,Z. G. Wang,&J. K. Shang.(2010).Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints.Journal of Materials Science & Technology,26(8),737-742.
MLA X. J. Wang,et al."Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints".Journal of Materials Science & Technology 26.8(2010):737-742.
条目包含的文件
文件名称/大小 文献类型 版本类型 开放类型 使用许可
1294.pdf(966KB) 开放获取--
个性服务
推荐该条目
保存到收藏夹
查看访问统计
导出为Endnote文件
谷歌学术
谷歌学术中相似的文章
[X. J. Wang]的文章
[Q. L. Zeng]的文章
[Q. S. Zhu]的文章
百度学术
百度学术中相似的文章
[X. J. Wang]的文章
[Q. L. Zeng]的文章
[Q. S. Zhu]的文章
必应学术
必应学术中相似的文章
[X. J. Wang]的文章
[Q. L. Zeng]的文章
[Q. S. Zhu]的文章
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。