Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints | |
X. J. Wang; Q. L. Zeng; Q. S. Zhu; Z. G. Wang; J. K. Shang | |
2010 | |
发表期刊 | Journal of Materials Science & Technology
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ISSN | 1005-0302 |
卷号 | 26期号:8页码:737-742 |
摘要 | Effects of electromigration on microstructure, shear strength, and fracture behavior of solder joints were investigated by single-ball shear samples of eutectic Sn-3.8Ag-0.7Cu (SAC) joined by Cu plates at two sides. The electromigratipn tests were conducted at a current density of about 1.1x10(3) A/cm(2) and a working temperature of about 83 degrees C. The results showed that the shear strength and flow stress decreased greatly after current stressing. Such a decrease was associated with no significant loss of the fracture strain at short electromigration but a great reduction in the fracture strain after long-term current stressing. The variation of the fracture strain with the electromigration time was shown to result from the shift of the fracture surface from the center of the solder towards the intermetallic compound (IMC) interface at the cathode. |
部门归属 | [wang, x. j.; zeng, q. l.; zhu, q. s.; wang, z. g.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jkshang@illinois.edu |
关键词 | Strength Fracture Strain Voids Solder Al Interconnects Electromigration Growth Lines Sn |
URL | 查看原文 |
WOS记录号 | WOS:000281708400012 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/31526 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | X. J. Wang,Q. L. Zeng,Q. S. Zhu,et al. Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints[J]. Journal of Materials Science & Technology,2010,26(8):737-742. |
APA | X. J. Wang,Q. L. Zeng,Q. S. Zhu,Z. G. Wang,&J. K. Shang.(2010).Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints.Journal of Materials Science & Technology,26(8),737-742. |
MLA | X. J. Wang,et al."Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints".Journal of Materials Science & Technology 26.8(2010):737-742. |
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