Interfacial diffusion in Cu with a gradient nanostructured surface layer

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	Interfacial diffusion in Cu with a gradient nanostructured surface layer
	Z. B. Wang; K. Lu; G. Wilde; S. V. Divinski
	2010
发表期刊	Acta Materialia
ISSN	1359-6454
卷号	58 期号:7 页码:2376-2386
摘要	A graded microstructure was produced in the surface layer of a pure Cu sample by means of surface mechanical attrition treatment (SMAT) [Wang K, Tao NR, Liu G, Lu J, Lu K. Acta Mater 2006;54:5281.]. The diffusion behavior of (63)Ni in such a surface layer was investigated by the radiotracer technique at temperatures <438 K. It is shown that the effective diffusivity in the top 10 mu m surface layer is more than 2 orders of magnitude higher than that along conventional high-angle grain boundaries (HAGB) in Cu of similar purity. The diffusion rate increases gradually with increasing depth up to 30-50 mu m, and then decreases with further increasing depth. The enhanced diffusivities reveal higher-energy states of various interfaces in the SMAT surface layer. The excess free energy of HAGB in this layer is estimated to be similar to 30% higher than that of conventional grain boundaries. An apparent retardation of the effective diffusion rate in the top 25 mu m surface layer is induced by tracer leakage into numerous twin-boundary-like interfaces, while the gradual decrease in interface excess free energy correlates with the observed decrease in diffusivity in the subsurface layer at depths exceeding 50 mu m. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[wang, z. b.; lu, k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [wilde, g.; divinski, s. v.] univ munster, inst mat phys, d-48149 munster, germany.;wang, zb (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, 72 wenhua rd, shenyang 110016, peoples r china;zbwang@imr.ac.cn divin@uni-muen-ster.de
关键词	Nanostructured Material Surface Mechanical Attrition Treatment Diffusion Grain Boundaries Twin Boundaries Grain-boundary Diffusion Mechanical Attrition Treatment Severe Plastic-deformation Nanocrystalline Copper Self-diffusion Nickel Alloys Bulk Temperatures Segregation
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WOS记录号	WOS:000276523200010
引用统计	被引频次：68[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31554
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Z. B. Wang,K. Lu,G. Wilde,et al. Interfacial diffusion in Cu with a gradient nanostructured surface layer[J]. Acta Materialia,2010,58(7):2376-2386.
APA	Z. B. Wang,K. Lu,G. Wilde,&S. V. Divinski.(2010).Interfacial diffusion in Cu with a gradient nanostructured surface layer.Acta Materialia,58(7),2376-2386.
MLA	Z. B. Wang,et al."Interfacial diffusion in Cu with a gradient nanostructured surface layer".Acta Materialia 58.7(2010):2376-2386.