Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate

IMR OpenIR

	Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate
	Q. K. Zhang; H. F. Zou; Z. F. Zhang
	2010
发表期刊	Journal of Materials Research
ISSN	0884-2914
卷号	25 期号:2 页码:303-314
摘要	To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu-X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, and fatigue life compared with those of the SnBi/Cu and SnAg/Cu joints. The experimental results demonstrate that even after aging for a long time, the addition of the Ag or Zn elements into the Cu substrate can effectively eliminate the interfacial Bi embrittlement of the SnBi/Cu-X joints under tensile or fatigue loadings. Compared with the conventional SnAg/Cu joints, the SnBi/Cu-X joints exhibit higher adhesive strength and comparable fatigue resistance. Finally, the fatigue and fracture mechanisms of the SnBi/Cu-X solder joints were discussed qualitatively. The current findings may pave the new way for the Sn-Bi solder widely used in the electronic interconnection in the future.
部门归属	[zhang, qingke; zou, hefei; zhang, zhe-feng] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
关键词	Interfacial Embrittlement Mechanical-properties Grain-boundaries Sn-3.5ag Solders Bismuth Solder Copper Segregation Metallization Interconnect Strength
URL	查看原文
WOS记录号	WOS:000274114400017
引用统计	被引频次：38[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31721
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. K. Zhang,H. F. Zou,Z. F. Zhang. Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate[J]. Journal of Materials Research,2010,25(2):303-314.
APA	Q. K. Zhang,H. F. Zou,&Z. F. Zhang.(2010).Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate.Journal of Materials Research,25(2),303-314.
MLA	Q. K. Zhang,et al."Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate".Journal of Materials Research 25.2(2010):303-314.