Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate

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	Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate
	X. F. Zhang; J. D. Guo; J. K. Shang
	2010
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	39 期号:3 页码:333-337
摘要	The effect of polarity on interfacial reactions under high-density electric current was investigated in Cu/FeNi/Sn/FeNi/Cu solder interconnects. A reverse polarity effect was found where the FeSn(2) intermetallic compound (IMC) layer at the cathode grew significantly thicker than that at the anode under electric loading. Such an abnormal polarity effect was shown to result from electromigration of Fe in the direction opposite to the electron flow. At the same time, a Cu-rich layer developed next to the FeSn(2) layer at the anode side. Kinetic analysis of Fe and Cu mass transport explained the differential growth of the IMCs at the two electrodes, in good agreement with the experimental data.
部门归属	[zhang, x. f.; guo, j. d.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;zhang, xf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jkshang@imr.ac.cn
关键词	Polarity Effect Current Stressing Effective Charge Feni Interfacial Reactions Thin-films Alloy Segregation Diffusion Kinetics
URL	查看原文
WOS记录号	WOS:000274947700010
引用统计	被引频次：3[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31726
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	X. F. Zhang,J. D. Guo,J. K. Shang. Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate[J]. Journal of Electronic Materials,2010,39(3):333-337.
APA	X. F. Zhang,J. D. Guo,&J. K. Shang.(2010).Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate.Journal of Electronic Materials,39(3),333-337.
MLA	X. F. Zhang,et al."Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate".Journal of Electronic Materials 39.3(2010):333-337.