Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM

IMR OpenIR

	Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM
	Q. S. Zhu; J. J. Guo; P. J. Shang; Z. G. Wang; J. K. Shang
	2010
发表期刊	Advanced Engineering Materials
ISSN	1438-1656
卷号	12 期号:6 页码:497-503
摘要	Effects of thermal aging on the interfacial microstructure and reliability of the SnAgCu/FeNi-Cu joint are investigated. It is found that aging effects depends strongly on the temperature. Aging at low temperature, e.g., at 125 degrees C, a submicron meter thick FeSn(2) IMC layer formed at the SnAgCu/FeNi-Cu interface during reflowing grows at a rate twenty times slower than the growth rate of the IMC at the SnAgCu/Cu interface. At high temperature, e.g., at 180 degrees C, the Cu element is found to diffuse through FeNi layer to produce the (Cu, Ni)(6)Sn(5) IMC and this IMC layer grows even faster than the IMC at the SnAgCu/Cu interface. Solder ball shear test results show that the SnAgCu/FeNi-Cu joint has a comparable strength to the SnAgCu/Cu joint after reflowing, and the strength drop after aging at 125 degrees C is less than that of the SnAgCu/Cu joint. However, after aging at 180 degrees C, the strength of the SnAgCu/FeNi-Cu joint is degraded to a low value, along with a shift in failure mode from the solder fracture to the brittle intermetallics fracture.
部门归属	[zhu, qing-sheng; guo, jian-jun; shang, pan-ju; wang, zhong-guang; shang, jian-ku] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, jian-ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;zhu, qs (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;qszhu@imr.ac.cn
关键词	p Alloy Film Sn-ag Solder Phosphorus Concentration Joints Strength Chip Metallization Interconnect Segregation Technology
URL	查看原文
WOS记录号	WOS:000280222800010
引用统计	被引频次：12[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31790
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. S. Zhu,J. J. Guo,P. J. Shang,et al. Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM[J]. Advanced Engineering Materials,2010,12(6):497-503.
APA	Q. S. Zhu,J. J. Guo,P. J. Shang,Z. G. Wang,&J. K. Shang.(2010).Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM.Advanced Engineering Materials,12(6),497-503.
MLA	Q. S. Zhu,et al."Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM".Advanced Engineering Materials 12.6(2010):497-503.