| Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints |
| H. F. Zou; Z. F. Zhang
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| 2010
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| 发表期刊 | Microelectronic Engineering
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| ISSN | 0167-9317
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| 卷号 | 87期号:4页码:601-609 |
| 摘要 | The effects of aging time, strain rate and solder thickness on fracture behaviors of Sn-3Cu/Cu single crystal joints were investigated. Experimental results showed that short aging time (less than 10 days) did not obviously affect the tensile strength and fracture behaviors of the solder joints. However, strain rate and solder thickness played significant roles in the strength and fracture behaviors of the solder joints. It was observed that these joints broke in a ductile manner at low strain rates with a rapid increase in the tensile strength, but displayed a brittle manner at high strain rates with a slow increase in the tensile strength. A model was proposed to explain such ductile-to-brittle transition between solder and intermetallic compounds. In addition, the solder joints broke in a ductile manner and presented a low tensile strength for the joints with thicker solder, but displayed a brittle manner and a higher tensile strength for the joints with thinner solder. (C) 2009 Elsevier B.V. All rights reserved. |
| 部门归属 | [zou, h. f.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zhfzhang@imr.ac.cn
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| 关键词 | Sn-cu Solder
Interfacial Strength
Intermetallic Compounds
Ductile-to-brittle Transition
Strain Rate
Fracture
Lead-free Solders
Intermetallic Compounds
Tensile Properties
Microstructure
Growth
Alloy
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| URL | 查看原文
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| WOS记录号 | WOS:000275264200015
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| 引用统计 |
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| 文献类型 | 期刊论文
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| 条目标识符 | http://ir.imr.ac.cn/handle/321006/31807
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| 专题 | 中国科学院金属研究所
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推荐引用方式
GB/T 7714 |
H. F. Zou,Z. F. Zhang. Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints[J]. Microelectronic Engineering,2010,87(4):601-609.
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| APA |
H. F. Zou,&Z. F. Zhang.(2010).Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints.Microelectronic Engineering,87(4),601-609.
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| MLA |
H. F. Zou,et al."Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints".Microelectronic Engineering 87.4(2010):601-609.
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