Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces

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	Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces
	H. Y. Guo; J. D. Guo; J. K. Shang
	2009
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	38 期号:12 页码:2470-2478
摘要	The thermal resistance of Si/Sn-52In/Cu sandwiched samples was measured by the laser flash method after various stages of thermal cycling. The thermal resistance was found to increase with increasing thermal cycles after 120 cycles. Cross-sections of the samples were examined by scanning electron microscopy. Cracks were observed in both the solder bulk and the interface between the intermetallic compound and solder. The increase of the thermal resistance was related to widening of the crack segments that were inclined to the interface.
部门归属	[guo, h. y.; guo, j. d.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;guo, hy (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;jdguo@imr.ac.cn
关键词	Solder Thermal Interface Materials Thermal Cycling Thermal Resistance Crack Propagation Joints Fatigue Shear
URL	查看原文
WOS记录号	WOS:000272301900008
引用统计	被引频次：5[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31935
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. Y. Guo,J. D. Guo,J. K. Shang. Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces[J]. Journal of Electronic Materials,2009,38(12):2470-2478.
APA	H. Y. Guo,J. D. Guo,&J. K. Shang.(2009).Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces.Journal of Electronic Materials,38(12),2470-2478.
MLA	H. Y. Guo,et al."Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces".Journal of Electronic Materials 38.12(2009):2470-2478.