| Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition |
| M. Liu; A. P. Xian
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| 2009
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| 发表期刊 | Journal of Electronic Materials
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| ISSN | 0361-5235
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| 卷号 | 38期号:11页码:2353-2361 |
| 摘要 | The phenomenon of rare earth (RE) additions inducing whisker growth in Sn-0.7Cu-Nd (0.1-5 wt.%Nd) solder is reported. The results showed that Nd exists as Sn(3)Nd in the microstructure of the solder alloys. A snowflake-like Sn(3)Nd was observed when Nd a parts per thousand currency sign 0.5 wt.%. After exposure to ambient conditions, the Nd-bearing alloys have a strong tendency toward whisker growth, with a short incubation time for whisker nucleation (only several hours). All whiskers originated from the Sn-Nd compound, where whiskers grew relatively fast; the average growth rate of the five longest whiskers was approximately 4 /s, and a 190 mu m whisker was observed within 480 h. Based on these results, it was predicted that whisker growth would be inevitable for all RE-bearing solders. The cause of this phenomenon is also discussed. Finally, the authors suggest that any solders doped with RE should be carefully considered again. |
| 部门归属 | [liu, meng; xian, ai-ping] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;liu, m (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;ap.xian@imr.ac.cn
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| 关键词 | Sn
Nd
Alloy
Soldering
Crystal Growth
Microstructure
Alloys
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| URL | 查看原文
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| WOS记录号 | WOS:000270634800020
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| 引用统计 |
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| 文献类型 | 期刊论文
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| 条目标识符 | http://ir.imr.ac.cn/handle/321006/32099
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| 专题 | 中国科学院金属研究所
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推荐引用方式
GB/T 7714 |
M. Liu,A. P. Xian. Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition[J]. Journal of Electronic Materials,2009,38(11):2353-2361.
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| APA |
M. Liu,&A. P. Xian.(2009).Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition.Journal of Electronic Materials,38(11),2353-2361.
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| MLA |
M. Liu,et al."Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition".Journal of Electronic Materials 38.11(2009):2353-2361.
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