Thermal properties of nanocrystalline Al composites reinforced by AlN nanoparticles | |
Y. Q. Liu; H. T. Cong; H. M. Cheng | |
2009 | |
发表期刊 | Journal of Materials Research
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ISSN | 0884-2914 |
卷号 | 24期号:1页码:24-31 |
摘要 | To explore potential applications of nanocomposites for microelectronic packaging, the thermal properties were investigated on newly developed nanocrystalline Al composites reinforced by AlN nanoparticles. It was found that the thermal conductivity (TC) is reduced with increasing AlN volume fraction (V(p)), since connectivity of Al matrix is decreased by introduction of the nanoparticles. Although AlN nanoparticles introduce thermal resistance, they still have significant contribution to the TC of the composite as high-TC inclusion. Particularly, a percolation behavior of AlN nanoparticles is thought to occur with the threshold at 23-30%. Measurements at elevated temperatures (similar to 500 degrees C) show almost no distinct degradation of TC relative to room temperature. Moreover, the coefficient of thermal expansion (CTE) is remarkably lowered as Vp increases, e.g., from 26 x 10(-6) to 13.9 x 10(-6) K(-1), by raising V(p) to 39%. Therefore. the nanocomposites may be applicable as electronic packaging material, due to the combination of acceptable TC and low CTE. |
部门归属 | [liu, y. q.; cong, h. t.; cheng, h. m.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;cong, ht (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;htcong@imr.ac.cn |
关键词 | Metal-matrix Composites Single-walled Carbon Particle-size Silicon-carbide Aluminum Composite Conductivity Expansion Resistance Nanotubes Nanocomposites |
URL | 查看原文 |
WOS记录号 | WOS:000267207500004 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/32136 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | Y. Q. Liu,H. T. Cong,H. M. Cheng. Thermal properties of nanocrystalline Al composites reinforced by AlN nanoparticles[J]. Journal of Materials Research,2009,24(1):24-31. |
APA | Y. Q. Liu,H. T. Cong,&H. M. Cheng.(2009).Thermal properties of nanocrystalline Al composites reinforced by AlN nanoparticles.Journal of Materials Research,24(1),24-31. |
MLA | Y. Q. Liu,et al."Thermal properties of nanocrystalline Al composites reinforced by AlN nanoparticles".Journal of Materials Research 24.1(2009):24-31. |
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