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Revealing the Maximum Strength in Nanotwinned Copper
L. Lu; X. Chen; X. Huang; K. Lu
2009
Source PublicationScience
ISSN0036-8075
Volume323Issue:5914Pages:607-610
AbstractThe strength of polycrystalline materials increases with decreasing grain size. Below a critical size, smaller grains might lead to softening, as suggested by atomistic simulations. The strongest size should arise at a transition in deformation mechanism from lattice dislocation activities to grain boundary- related processes. We investigated the maximum strength of nanotwinned copper samples with different twin thicknesses. We found that the strength increases with decreasing twin thickness, reaching a maximum at 15 nanometers, followed by a softening at smaller values that is accompanied by enhanced strain hardening and tensile ductility. The strongest twin thickness originates from a transition in the yielding mechanism from the slip transfer across twin boundaries to the activity of preexisting easy dislocation sources.
description.department[lu, l.; chen, x.; lu, k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [huang, x.] tech univ denmark, riso natl lab sustainable energy, ctr fundamental res met struct four dimens, dept mat res, dk-4000 roskilde, denmark.;lu, l (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;llu@imr.ac.cn
KeywordStrain-rate Sensitivity Coherent Twin Boundaries Centered-cubic Metals Nanocrystalline Copper Nanostructured Metals Mechanical-properties Tensile Properties Dislocations Deformation Cu
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/32152
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
L. Lu,X. Chen,X. Huang,et al. Revealing the Maximum Strength in Nanotwinned Copper[J]. Science,2009,323(5914):607-610.
APA L. Lu,X. Chen,X. Huang,&K. Lu.(2009).Revealing the Maximum Strength in Nanotwinned Copper.Science,323(5914),607-610.
MLA L. Lu,et al."Revealing the Maximum Strength in Nanotwinned Copper".Science 323.5914(2009):607-610.
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