| An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy |
| M. Sang; K. Du; H. Q. Ye
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| 2009
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| 发表期刊 | Journal of Alloys and Compounds
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| ISSN | 0925-8388
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| 卷号 | 469期号:1-2页码:129-136 |
| 摘要 | Cu(3)Sn phase with the D0(19) structure is observed in Cu-Sn alloy by transmission electron microscopy, The structure is determined by electron diffraction, high-resolution transmission electron microscopy and high-angle annular dark-field imaging techniques. To the best of our knowledge this structure has not been reported before in Cu(3)Sn compounds. Transmission electron microscopy revealed high-density antiphase boundaries lying on the (0 (1) over bar 10) planes with translation vectors of (a/2)((2) over bar 110) in the D0(19) Cu(3)Sn. (C) 2008 Elsevier B.V. All rights reserved |
| 部门归属 | [sang, mahan; du, kui; ye, hengqiang] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [sang, mahan] chinese acad sci, grad sch, beijing 100049, peoples r china.;du, k (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china;kuidu@imr.ac.cn
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| 关键词 | Intermetallics
Crystal Structure
Cu(3)Sn
Transmission Electron
Microscopy
Pb-free Solders
Interfacial Reactions
High-resolution
Tin-lead
Intermetallics
Copper
Contrast
Nanoindentation
Interconnects
Kinetics
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| URL | 查看原文
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| 文献类型 | 期刊论文
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| 条目标识符 | http://ir.imr.ac.cn/handle/321006/32258
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| 专题 | 中国科学院金属研究所
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推荐引用方式
GB/T 7714 |
M. Sang,K. Du,H. Q. Ye. An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy[J]. Journal of Alloys and Compounds,2009,469(1-2):129-136.
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| APA |
M. Sang,K. Du,&H. Q. Ye.(2009).An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy.Journal of Alloys and Compounds,469(1-2),129-136.
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| MLA |
M. Sang,et al."An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy".Journal of Alloys and Compounds 469.1-2(2009):129-136.
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