Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates

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	Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates
	P. J. Shang; Z. Q. Liu; X. Y. Pang; D. X. Li; J. K. Shang
	2009
发表期刊	Acta Materialia
ISSN	1359-6454
卷号	57 期号:16 页码:4697-4706
摘要	A comprehensive transmission electron microscopy (TEM) study was conducted to investigate the growth mechanisms Of Cu(3)Sn on polycrystalline and single crystalline Cu substrates in solder joints. On single crystalline Cu the solder reflow process resulted in the growth of columnar Cu(3)Sn grains aligned in a thin uniform layer perpendicular to the interface, while a thick Cu(3)Sn layer formed from fine equiaxed grains on the polycrystalline substrate. In the subsequent solid state aging, columnar growth Of Cu(3)Sn continued on the single crystalline Cu before it was replaced by nucleation and growth of new triangular Cu(3)Sn grains at the triple junction sites of the Cu/Cu(3)Sn interface. On the polycrystalline Cu the solid state aging caused much more rapid growth of the Cu(3)Sn layer due to nucleation and the growth of new Cu(3)Sn grains at both the Cu/Cu(3)Sn and Cu(6)Sn(5)/Cu(3)Sn interfaces. These different growth behaviors Of Cu(3)Sn were related to the diffusive supply of reactive elements. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[shang, p. j.; liu, z. q.; pang, x. y.; li, d. x.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;liu, zq (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china;zqliu@imr.ac.cn jkshang@uiuc.edu
关键词	Cu(3)Sn Growth Mechanism Interface Soldering Transmission Electron Microscopy Solder Joints Interfacial Reactions Intermetallic Growth Reactive Interface Diffusion Couples Molten Sn Temperature Technology Copper Layers
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32262
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	P. J. Shang,Z. Q. Liu,X. Y. Pang,et al. Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates[J]. Acta Materialia,2009,57(16):4697-4706.
APA	P. J. Shang,Z. Q. Liu,X. Y. Pang,D. X. Li,&J. K. Shang.(2009).Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates.Acta Materialia,57(16),4697-4706.
MLA	P. J. Shang,et al."Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates".Acta Materialia 57.16(2009):4697-4706.