An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys

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	An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys; An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys
	H. Q. Sun; Y. N. Shi
	2009 ; 2009
发表期刊	Journal of Materials Science & Technology ; Journal of Materials Science & Technology
ISSN	1005-0302 ; 1005-0302
卷号	25 期号:3 页码:347-350
摘要	Nanocrystalline Cu-Ni-P alloys with average grain sizes of 7, 10 and 24 nm were synthesized by means of electrodeposition. The grain size dependences of tensile strength and hardness of the nanocrystalline Cu alloys were investigated. The breakdown of Hall-Petch relation was exhibited in both tensile strength and hardness.; Nanocrystalline Cu-Ni-P alloys with average grain sizes of 7, 10 and 24 nm were synthesized by means of electrodeposition. The grain size dependences of tensile strength and hardness of the nanocrystalline Cu alloys were investigated. The breakdown of Hall-Petch relation was exhibited in both tensile strength and hardness.
部门归属	[sun, haiqing; shi, yinong] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;shi, yn (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, 72 wenhua rd, shenyang 110016, peoples r china;yinongshi@imr.ac.cn ; [sun, haiqing; shi, yinong] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;shi, yn (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, 72 wenhua rd, shenyang 110016, peoples r china;yinongshi@imr.ac.cn
关键词	Nanomaterials Nanomaterials Mechanical Properties Mechanical Properties Hardness Hardness Strain-rate Sensitivity Strain-rate Sensitivity Tomographic Atom-probe Tomographic Atom-probe Plastic-deformation Plastic-deformation Mechanical-behavior Mechanical-behavior Thermal-stability Thermal-stability Metals Metals Copper Copper Strength Strength Fracture Fracture Microstructure Microstructure
URL	查看原文 ; 查看原文
WOS记录号	WOS:000266847000010 ; WOS:000266847000010
引用统计	被引频次：9[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32304
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. Q. Sun,Y. N. Shi. An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys, An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys[J]. Journal of Materials Science & Technology, Journal of Materials Science & Technology,2009, 2009,25, 25(3):347-350, 347-350.
APA	H. Q. Sun,&Y. N. Shi.(2009).An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys.Journal of Materials Science & Technology,25(3),347-350.
MLA	H. Q. Sun,et al."An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys".Journal of Materials Science & Technology 25.3(2009):347-350.