Electroless Ni-P coating on W-Cu alloy via potential activation process

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	Electroless Ni-P coating on W-Cu alloy via potential activation process; Electroless Ni-P coating on W-Cu alloy via potential activation process
	L. L. Wang; H. J. Chen; W. Q. Huang; L. Hao
	2009 ; 2009
发表期刊	Surface Engineering ; Surface Engineering
ISSN	0267-0844 ; 0267-0844
卷号	25 期号:5 页码:376-381
摘要	Electroless Ni-P coating was deposited on W-Cu alloy via potential activation at -0.8 V. The coating was characterised for its morphology, structure, microhardness and the corrosion resistance. Scanning electron microscopy observation showed the presence of smooth and compact crystals in the coating. X-ray diffraction analysis showed that the Ni-P coating was amorphous in structure. The adhesion between Ni-P coating and W-Cu alloy was qualified. Heat treatment can improve the microhardness of Ni-P coating. Both the porosity test and immersion test in 10 vol.-% H(2)SO(4) solution revealed that the Ni-P coating exhibited good corrosion resistance properties in protecting the W-Cu alloy.; Electroless Ni-P coating was deposited on W-Cu alloy via potential activation at -0.8 V. The coating was characterised for its morphology, structure, microhardness and the corrosion resistance. Scanning electron microscopy observation showed the presence of smooth and compact crystals in the coating. X-ray diffraction analysis showed that the Ni-P coating was amorphous in structure. The adhesion between Ni-P coating and W-Cu alloy was qualified. Heat treatment can improve the microhardness of Ni-P coating. Both the porosity test and immersion test in 10 vol.-% H(2)SO(4) solution revealed that the Ni-P coating exhibited good corrosion resistance properties in protecting the W-Cu alloy.
部门归属	[wang, l. l.; chen, h. j.] xinyang normal univ, coll chem & chem engn, xinyang 464000, peoples r china. [huang, w. q.] anhui vocat & tech coll ind & trade, huainan 232001, peoples r china. [hao, l.] chinese acad sci, environm corros ctr, inst met res, shenyang 110016, peoples r china.;wang, ll (reprint author), xinyang normal univ, coll chem & chem engn, xinyang 464000, peoples r china;xysywll2008@126.com ; [wang, l. l.; chen, h. j.] xinyang normal univ, coll chem & chem engn, xinyang 464000, peoples r china. [huang, w. q.] anhui vocat & tech coll ind & trade, huainan 232001, peoples r china. [hao, l.] chinese acad sci, environm corros ctr, inst met res, shenyang 110016, peoples r china.;wang, ll (reprint author), xinyang normal univ, coll chem & chem engn, xinyang 464000, peoples r china;xysywll2008@126.com
关键词	Electroless Deposition Electroless Deposition Ni-p Coating Ni-p Coating W-cu Alloy W-cu Alloy Adhesion Adhesion Microhardness Microhardness Corrosion Resistance Corrosion Resistance Sintering Behavior Sintering Behavior Nickel Nickel Composite Composite Powders Powders
URL	查看原文 ; 查看原文
WOS记录号	WOS:000266528100007 ; WOS:000266528100007
引用统计	被引频次：9[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32361
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	L. L. Wang,H. J. Chen,W. Q. Huang,et al. Electroless Ni-P coating on W-Cu alloy via potential activation process, Electroless Ni-P coating on W-Cu alloy via potential activation process[J]. Surface Engineering, Surface Engineering,2009, 2009,25, 25(5):376-381, 376-381.
APA	L. L. Wang,H. J. Chen,W. Q. Huang,&L. Hao.(2009).Electroless Ni-P coating on W-Cu alloy via potential activation process.Surface Engineering,25(5),376-381.
MLA	L. L. Wang,et al."Electroless Ni-P coating on W-Cu alloy via potential activation process".Surface Engineering 25.5(2009):376-381.