Direct diffusion bonding of Ti(3)SiC(2) and Ti(3)AlC(2)

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	Direct diffusion bonding of Ti(3)SiC(2) and Ti(3)AlC(2)
	X. H. Yin; M. S. Li; J. J. Xu; J. Zhang; Y. C. Zhou
	2009
发表期刊	Materials Research Bulletin
ISSN	0025-5408
卷号	44 期号:6 页码:1379-1384
摘要	Two typical layered ternary compounds. Ti(3)SiC(2) and Ti(3)AlC(2), were joined directly by solid-state diffusion bonding method. By various bonding tests at 1100-1300 degrees C for 30-120 min under 10-30 MPa, and characterizing the microstructure and diffusion reactive phases of the joints by scanning electron microscopy (SEM). energy dispersive X-ray spectrometer (EDS), transmission electron microscopy (TEM) and X-ray diffraction (XRD). the optimal condition for direct joining of Ti(3)SiC(2) and Ti(3)AlC(2) was obtained. Strong joints of Ti(3)SiC(2)/Ti(3)AlC(2) can be achieved via diffusion bonding, which is attributed to remarkable interdiffusion of Si and Al at the joint interface. The shear strength of the Ti(3)SiC(2)/Ti(3)AlC(2) joints was determined. (C) 2008 Elsevier Ltd. All rights reserved.
部门归属	[li, meishuan; xu, jingjun; zhang, jie; zhou, yanchun] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, liaoning prov, peoples r china. [yin, xiaohui] anhui univ technol, sch mat sci & engn, maanshan 243002, anhui, peoples r china.;li, ms (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, 72 wenhua rd, shenyang 110016, liaoning prov, peoples r china;mshli@imr.ac.cn
关键词	Carbids Layered Compounds Diffusion Microstructure Liquid Reaction Synthesis Ti3al1-xsixc2 Solid-solutions Mechanical Strength Oxidation Behavior Microstructure Ceramics Si Interlayer Carbide Joints
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文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32507
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	X. H. Yin,M. S. Li,J. J. Xu,et al. Direct diffusion bonding of Ti(3)SiC(2) and Ti(3)AlC(2)[J]. Materials Research Bulletin,2009,44(6):1379-1384.
APA	X. H. Yin,M. S. Li,J. J. Xu,J. Zhang,&Y. C. Zhou.(2009).Direct diffusion bonding of Ti(3)SiC(2) and Ti(3)AlC(2).Materials Research Bulletin,44(6),1379-1384.
MLA	X. H. Yin,et al."Direct diffusion bonding of Ti(3)SiC(2) and Ti(3)AlC(2)".Materials Research Bulletin 44.6(2009):1379-1384.