Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects

IMR OpenIR

	Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects
	J. Zhang; J. Y. Zhang; G. Liu; Y. Zhao; X. D. Ding; G. P. Zhang; J. Sun
	2009
发表期刊	Scripta Materialia
ISSN	1359-6462
卷号	60 期号:4 页码:228-231
摘要	Thermal fatigue of Cu interconnects 60 nm thick and 5-15 mu m wide was investigated by using alternating current to generate cycling temperature and strain/stress. The fatigue curves exhibit two regions, i.e. high- and low-cycle regions, which correspond to low and high thermal strains, respectively. The high-cycle region is found to be controlled by all unusual thermal Fatigue mechanism of damage hands, which is related to a unique structure comprising only a single layer of grains distributed along the thickness. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属	[zhang, j.; zhang, j. y.; liu, g.; zhao, y.; ding, x. d.; sun, j.] xi an jiao tong univ, state key lab mech behav mat, xian 710049, peoples r china. [zhang, j.; zhang, j. y.; liu, g.; zhao, y.; ding, x. d.; sun, j.] xi an jiao tong univ, sch mat sci & engn, xian 710049, peoples r china. [zhang, g. p.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;sun, j (reprint author), xi an jiao tong univ, state key lab mech behav mat, xian 710049, peoples r china;junsun@mail.xjtu.edu.cn
关键词	Thermal Fatigue Thin Films Copper-films Electromigration Lifetime Damage
URL	查看原文
WOS记录号	WOS:000263281100010
引用统计	被引频次：16[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32549
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	J. Zhang,J. Y. Zhang,G. Liu,et al. Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects[J]. Scripta Materialia,2009,60(4):228-231.
APA	J. Zhang.,J. Y. Zhang.,G. Liu.,Y. Zhao.,X. D. Ding.,...&J. Sun.(2009).Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects.Scripta Materialia,60(4),228-231.
MLA	J. Zhang,et al."Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects".Scripta Materialia 60.4(2009):228-231.