| Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times |
| Q. K. Zhang; Z. F. Zhang
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| 2009
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| 发表期刊 | Journal of Alloys and Compounds
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| ISSN | 0925-8388
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| 卷号 | 485期号:1-2页码:853-861 |
| 摘要 | Tensile properties and fracture mechanisms of Cu/Sn-4Ag solder joints aged at 180 degrees C for different times were investigated at the strain rates of 1.25 x 10(-4) s(-1) and 1.25 x 10(-1) s(-1) At the low strain rate, it was found that the tensile strength of the solder joints decreased with increasing aging time in principle. though the tendency was not monotonously at the early stage of aging, and all the solder joints had similar tensile curves but different fracture morphologies and fracture processes. At the high strain rate, tensile strength of the solder joints was much higher and decreased monotonously with increasing aging time, with identical fracture process and fractographies. Evolution of the Cu/Sn-4Ag interfacial morphology during aging process and the effect of aging on tensile property of the Sn-4Ag alloy were also involved for further analysis. Based on the experimental results and observations, the fracture processes were revealed and some factors controlling the tensile strength of solder joints were discussed qualitatively (C) 2009 Elsevier B.V. All rights reserved |
| 部门归属 | [zhang, q. k.; zhang, z. f.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china
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| 关键词 | Sn-4ag Solder
Interfacial Imcs
Tensile Properties
Strain Rate
Fracture Mechanism
Lead-free Solders
Sn-ag
Shear-strength
Tensile Properties
Intermetallic Compound
Deformation-behavior
Strain-rate
Interfacial
Reaction
Cu Substrate
Microstructure
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| URL | 查看原文
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| WOS记录号 | WOS:000271542900176
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| 引用统计 |
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| 文献类型 | 期刊论文
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| 条目标识符 | http://ir.imr.ac.cn/handle/321006/32561
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| 专题 | 中国科学院金属研究所
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推荐引用方式
GB/T 7714 |
Q. K. Zhang,Z. F. Zhang. Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times[J]. Journal of Alloys and Compounds,2009,485(1-2):853-861.
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| APA |
Q. K. Zhang,&Z. F. Zhang.(2009).Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times.Journal of Alloys and Compounds,485(1-2),853-861.
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| MLA |
Q. K. Zhang,et al."Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times".Journal of Alloys and Compounds 485.1-2(2009):853-861.
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